1-10 Revision 10 Boundary Scan Testing (BST) All eX devices are IEEE 1149.1 compliant. eX devices offer s" />
參數(shù)資料
型號(hào)： EX128-TQG64A
廠商： Microsemi SoC
文件頁(yè)數(shù)： 6/48頁(yè)
文件大?。?/td> 0K
描述： IC FPGA ANTIFUSE 6K 64-TQFP
標(biāo)準(zhǔn)包裝： 160
系列： EX
邏輯元件/單元數(shù)： 256
輸入/輸出數(shù)： 46
門數(shù)： 6000
電源電壓： 2.3 V ~ 2.7 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 125°C
封裝/外殼： 64-LQFP
供應(yīng)商設(shè)備封裝： 64-TQFP（10x10）
eX FPGA Architecture and Characteristics
1-10
Revision 10
Boundary Scan Testing (BST)
All eX devices are IEEE 1149.1 compliant. eX devices offer superior diagnostic and testing capabilities by
providing Boundary Scan Testing (BST) and probing capabilities. These functions are controlled through
the special test pins (TMS, TDI, TCK, TDO and TRST). The functionality of each pin is defined by two
available modes: Dedicated and Flexible, and is described in Table 1-4. In the dedicated test mode, TCK,
TDI, and TDO are dedicated pins and cannot be used as regular I/Os. In flexible mode (default mode),
TMS should be set HIGH through a pull-up resistor of 10 k
. TMS can be pulled LOW to initiate the test
sequence.
Dedicated Test Mode
In Dedicated mode, all JTAG pins are reserved for BST; designers cannot use them as regular I/Os. An
internal pull-up resistor is automatically enabled on both TMS and TDI pins, and the TMS pin will function
as defined in the IEEE 1149.1 (JTAG) specification.
To select Dedicated mode, users need to reserve the JTAG pins in Microsemi's Designer software by
checking the Reserve JTAG box in the Device Selection Wizard (Figure 1-12). JTAG pins comply with
LVTTL/TTL I/O specification regardless of whether they are used as a user I/O or a JTAG I/O. Refer to
page 1-18 for detailed specifications.
Flexible Mode
In Flexible Mode, TDI, TCK and TDO may be used as either user I/Os or as JTAG input pins. The internal
resistors on the TMS and TDI pins are disabled in flexible JTAG mode, and an external 10 k
pull-
resistor to VCCI is required on the TMS pin.
To select the Flexible mode, users need to clear the check box for Reserve JTAG in the Device Selection
Wizard in Microsemi's Designer software. The functionality of TDI, TCK, and TDO pins is controlled by
the BST TAP controller. The TAP controller receives two control inputs, TMS and TCK. Upon power-up,
the TAP controller enters the Test-Logic-Reset state. In this state, TDI, TCK, and TDO function as user
I/Os. The TDI, TCK, and TDO pins are transformed from user I/Os into BST pins when the TMS pin is
LOW at the first rising edge of TCK. The TDI, TCK, and TDO pins return to user I/Os when TMS is held
HIGH for at least five TCK cycles.
Table 1-4 Boundary Scan Pin Functionality
Dedicated Test Mode
Flexible Mode
TCK, TDI, TDO are dedicated BST pins
TCK, TDI, TDO are flexible and may be used as I/Os
No need for pull-up resistor for TMS and TDI
Use a pull-up resistor of 10 k
on TMS
Figure 1-12 Device Selection Wizard
相關(guān)PDF資料
PDF描述
ABC60DRTH-S13 CONN EDGECARD 120PS DIP .100 SLD
RMC10DTEF CONN EDGECARD 20POS .100 EYELET
ACC65DREF CONN EDGECARD 130PS .100 EYELET
ABC65DREF CONN EDGECARD 130PS .100 EYELET
ACB35DHAR CONN EDGECARD 70POS R/A .050 DIP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EX128-TQG64I 功能描述:IC FPGA ANTIFUSE 6K 64-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:EX 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14）
EX12BTQ64I 制造商:ACTEL 功能描述:New
EX12L-120PC/3E-GL/L 制造商:Hirose 功能描述:
EX12L-120PC/3E-GL/L(50) 功能描述:集管和線殼 HIROSE ELECTRIC RoHS:否 產(chǎn)品種類:1.0MM Rectangular Connectors 產(chǎn)品類型:Headers - Pin Strip 系列:DF50 觸點(diǎn)類型:Pin (Male) 節(jié)距:1 mm 位置/觸點(diǎn)數(shù)量:16 排數(shù):1 安裝風(fēng)格:SMD/SMT 安裝角:Right 端接類型:Solder 外殼材料:Liquid Crystal Polymer (LCP) 觸點(diǎn)材料:Brass 觸點(diǎn)電鍍:Gold 制造商:Hirose Connector
EX12L-120PC/3E-GL/L(51) 功能描述:集管和線殼 HIROSE ELECTRIC RoHS:否 產(chǎn)品種類:1.0MM Rectangular Connectors 產(chǎn)品類型:Headers - Pin Strip 系列:DF50 觸點(diǎn)類型:Pin (Male) 節(jié)距:1 mm 位置/觸點(diǎn)數(shù)量:16 排數(shù):1 安裝風(fēng)格:SMD/SMT 安裝角:Right 端接類型:Solder 外殼材料:Liquid Crystal Polymer (LCP) 觸點(diǎn)材料:Brass 觸點(diǎn)電鍍:Gold 制造商:Hirose Connector
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*