Revision 10 1-29 Table 1-19 eX Family Timing Characteristics (Worst-Case Commercial Conditions VCCA = 2.3" />
參數(shù)資料
型號: EX128-TQG64A
廠商: Microsemi SoC
文件頁數(shù): 27/48頁
文件大?。?/td> 0K
描述: IC FPGA ANTIFUSE 6K 64-TQFP
標準包裝: 160
系列: EX
邏輯元件/單元數(shù): 256
輸入/輸出數(shù): 46
門數(shù): 6000
電源電壓: 2.3 V ~ 2.7 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 125°C
封裝/外殼: 64-LQFP
供應商設備封裝: 64-TQFP(10x10)
eX Family FPGAs
Revision 10
1-29
Table 1-19 eX Family Timing Characteristics
(Worst-Case Commercial Conditions VCCA = 2.3V, VCCI = 2.3 V or 3.0V, TJ = 70°C)
‘–P’ Speed
‘Std’ Speed
‘–F’ Speed
Parameter
Description
Min.
Max.
Min.
Max.
Min.
Max.
Units
Dedicated (Hard-Wired) Array Clock Networks
tHCKH
Input LOW to HIGH
(Pad to R-Cell Input)
1.1
1.6
2.3
ns
tHCKL
Input HIGH to LOW
(Pad to R-Cell Input)
1.1
1.6
2.3
ns
tHPWH
Minimum Pulse Width HIGH
1.4
2.0
2.8
ns
tHPWL
Minimum Pulse Width LOW
1.4
2.0
2.8
ns
tHCKSW
Maximum Skew
<0.1
ns
tHP
Minimum Period
2.8
4.0
5.6
ns
fHMAX
Maximum Frequency
357
250
178
MHz
Routed Array Clock Networks
tRCKH
Input LOW to HIGH (Light Load)
(Pad to R-Cell Input) MAX.
1.0
1.4
2.0
ns
tRCKL
Input HIGH to LOW (Light Load)
(Pad to R-Cell Input) MAX.
1.0
1.4
2.0
ns
tRCKH
Input LOW to HIGH (50% Load)
(Pad to R-Cell Input) MAX.
1.2
1.7
2.4
ns
tRCKL
Input HIGH to LOW (50% Load)
(Pad to R-Cell Input) MAX.
1.2
1.7
2.4
ns
tRCKH
Input LOW to HIGH (100% Load)
(Pad to R-Cell Input) MAX.
1.4
2.0
2.8
ns
tRCKL
Input HIGH to LOW (100% Load)
(Pad to R-Cell Input) MAX.
1.4
2.0
2.8
ns
tRPWH
Min. Pulse Width HIGH
1.4
2.0
2.8
ns
tRPWL
Min. Pulse Width LOW
1.4
2.0
2.8
ns
tRCKSW*
Maximum Skew (Light Load)
0.2
0.3
0.4
ns
tRCKSW*
Maximum Skew (50% Load)
0.2
0.3
ns
tRCKSW*
Maximum Skew (100% Load)
0.1
0.2
ns
Note: *Clock skew improves as the clock network becomes more heavily loaded.
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相關代理商/技術參數(shù)
參數(shù)描述
EX128-TQG64I 功能描述:IC FPGA ANTIFUSE 6K 64-TQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:EX 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設備封裝:289-CSP(14x14)
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