參數(shù)資料
型號(hào)： EP20K60EFC324
廠商： ALTERA CORP
元件分類： PLD
英文描述： LOADABLE PLD, PBGA324
封裝： 19 X 19 MM, 1 MM PITCH, FINE LINE, BGA-324
文件頁數(shù)： 28/114頁
文件大?。?/td> 4116K
代理商： EP20K60EFC324
IGLOO nano DC and Switching Characteristics
2- 6
A d vance v0.2
Thermal Characteristics
Introduction
The temperature variable in the Actel Designer software refers to the junction temperature, not
the ambient temperature. This is an important distinction because dynamic and static power
consumption cause the chip junction temperature to be higher than the ambient temperature.
EQ 2-1 can be used to calculate junction temperature.
TJ = Junction Temperature = T + TA
EQ 2-1
where:
TA = Ambient temperature
T = Temperature gradient between junction (silicon) and ambient T = θja * P
θja = Junction-to-ambient of the package. θja numbers are located in Figure 2-5.
P = Power dissipation
Package Thermal Characteristics
The device junction-to-case thermal resistivity is
θjc and the junction-to-ambient air thermal
resistivity is
θja. The thermal characteristics for θja are shown for two air flow rates. The maximum
operating junction temperature is 100°C. EQ 2-2 shows a sample calculation of the maximum
operating power dissipation allowed for a 484-pin FBGA package at commercial temperature and
in still air.
EQ 2-2
Temperature and Voltage Derating Factors
Maximum Power Allowed
Max. junction temp. (
° C) Max. ambient temp. (° C)
–
θ
ja(° C/W)
-----------------------------------------------------------------------------------------------------------------------------------------
100
° C70° C
–
20.5°C/W
--------------------------------------
1.46 W
=
Table 2-5
Package Thermal Resistivities
Package Type
Pin
Count
θjc
θja
Units
Still Air
200 ft./
min.
500 ft./
min.
Chip Scale Package (CSP)
36
TBD
C/W
81
TBD
C/W
Quad Flat No Lead (QFN)
48
TBD
C/W
68
TBD
C/W
100
TBD
C/W
Very Thin Quad Flat Pack (VQFP)
100
10.0
35.3
29.4
27.1
C/W
Table 2-6
Temperature and Voltage Derating Factors for Timing Delays (normalized to TJ = 70°C,
VCC =1.425 V)
For IGLOO nano V2 or V5 Devices, 1.5 V DC Core Supply Voltage
Array Voltage
VCC (V)
Junction Temperature (°C)
–40°C
–20°C
0°C
25°C
70°C
85°C
125°C
1.425
0.966
0.972
0.977
0.991
1.000
1.006
1.013
1.5
0.877
0.882
0.888
0.899
0.907
0.913
0.919
1.575
0.815
0.820
0.824
0.835
0.843
0.848
0.854
相關(guān)PDF資料
PDF描述
EP20K60EFC484-1 LOADABLE PLD, PBGA484
EP20K60EFC484-2 LOADABLE PLD, PBGA484
EP20K60EFC484-3 LOADABLE PLD, PBGA484
EP20K60EFC484 LOADABLE PLD, PBGA484
EP20K60EFC672-1 LOADABLE PLD, PBGA672
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
EP20K60EFC324-1 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 CPLD - APEX 20K 256 Macro 196 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP20K60EFC324-1ES 制造商:未知廠家 制造商全稱:未知廠家 功能描述:FPGA
EP20K60EFC324-1N 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 CPLD - APEX 20K 256 Macro 196 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP20K60EFC324-1X 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 CPLD - APEX 20K 256 Macro 196 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
EP20K60EFC324-2 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 CPLD - APEX 20K 256 Macro 196 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
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