參數(shù)資料
型號: DS3172N+
廠商: Maxim Integrated Products
文件頁數(shù): 221/234頁
文件大?。?/td> 0K
描述: IC TXRX DS3/E3 DUAL 400-BGA
產(chǎn)品培訓(xùn)模塊: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
標(biāo)準(zhǔn)包裝: 4
功能: 單芯片收發(fā)器
接口: DS3,E3
電路數(shù): 2
電源電壓: 3.135 V ~ 3.465 V
電流 - 電源: 328mA
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 400-BBGA
供應(yīng)商設(shè)備封裝: 400-PBGA(27x27)
包裝: 管件
包括: DS3 調(diào)幀器,E3 調(diào)幀器,HDLC 控制器,芯片內(nèi) BERT
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DS3171/DS3172/DS3173/DS3174
87
10.6.6.3 Transmit M23 DS3 Error Insertion
Error insertion inserts various types of errors into the different DS3 overhead bits. The types of errors that can be
inserted are framing errors and P-bit parity errors.
The framing error insertion mode is programmable (F-bit, M-bit, SEF, or OOMF). An F-bit error is a single subframe
alignment bit (FXY) error. An M-bit error is a single multiframe alignment bit (M1, M2, or M3) error. An SEF error is an
error in all the subframe alignment bits in a subframe (FX1, FX2, FX3, and FX4). An OOMF error is a single multiframe
alignment bit (M1, M2, or M3) error in each of two consecutive DS3 frames.
A P-bit parity error is generated by is inverting the value of the P-bits (P1 and P2) in a single DS3 frame. P-bit parity
error(s) can be inserted one error at a time, or continuously. The P-bit parity error insertion mode (single or
continuous) is programmable.
Each error type (framing or P-bit parity) has a separate enable. Continuous error insertion mode inserts errors at
every opportunity. Single error insertion mode inserts an error at the next opportunity when requested. The framing
multi-error insertion modes (SEF or OOMF) insert the indicated number of error(s) at the next opportunities when
requested; i.e., a single request will cause multiple errors to be inserts. The requests can be initiated by a register
bit(TSEI) or by the manual error insertion input (TMEI). The error insertion request source (register or input) is
programmable. The insertion of each particular error type is individually enabled. Once all error insertion has been
performed, the data stream is passed on to overhead insertion.
10.6.6.4 Transmit M23 DS3 Overhead Insertion
Overhead insertion can insert any (or all) of the DS3 overhead bits into the DS3 frame. The DS3 overhead bits X1,
X2, P1, P2, MX, FXY, and CXY can be sourced from the transmit overhead interface (TOHCLK, TOH, TOHEN, and
TOHSOF). The P-bits (P1 and P2) are received as an error mask (modulo 2 addition of the input bit and the
internally generated bit). The DS3 overhead insertion is fully controlled by the transmit overhead interface. If the
transmit overhead data enable signal (TOHEN) is driven high, then the bit on the transmit overhead signal (TOH) is
inserted into the output data stream. Insertion of bits using the TOH signal overwrites internal overhead insertion.
10.6.6.5 Transmit M23 DS3 AIS/Idle Generation
M23 DS3 AIS/Idle generation overwrites the data stream with AIS or an Idle signal. If transmit Idle is enabled, the
data stream payload is forced to a 1100 pattern with two ones immediately following each DS3 overhead bit. M1,
M2, and M3 bits are overwritten with the values zero, one, and zero (010) respectively. FX1, FX2, FX3, and FX4 bits are
overwritten with the values one, zero, zero, and one (1001) respectively. X1 and X2 are overwritten with 11. P1 and
P2 are overwritten with the calculated payload parity from the previous output DS3 frame. And, C31, C32, and C33
are overwritten with 000.
If transmit AIS is enabled, the data stream payload is forced to a 1010 pattern with a one immediately following
each DS3 overhead bit. M1, M2, and M3 bits are overwritten with the values zero, one, and zero (010) respectively.
FX1, FX2, FX3, and FX4 bits are overwritten with the values one, zero, zero, and one (1001) respectively. X1 and X2
are overwritten with 11. P1 and P2 are overwritten with the calculated payload parity from the previous DS3 frame.
And, CX1, CX2, and CX3 are overwritten with 000. AIS will overwrite a transmit Idle signal.
10.6.6.5.1 Receive M23 DS3 Frame Format
The DS3 frame format is shown in Figure 10-14. The X1 and X2 are the Remote Defect Indication (RDI) bits (also
referred to as the far-end SEF/AIS bits). P1 and P2 are the parity bits used for line error monitoring. M1, M2, and M3
are the multiframe alignment bits that define the multiframe boundary. FXY are the subframe alignment bits that
define the subframe boundary. Note: Both the M-bits and F-bits define the DS3 frame boundary. C11 is the
Application Identification Channel (AIC). CX1, CX2, and CX3 are the stuff control bits for tributary #X.
10.6.6.5.2 Receive M23 DS3 Overhead Extraction
Overhead extraction extracts all of the DS3 overhead bits from the M23 DS3 frame. All of the DS3 overhead bits
X1, X2, P1, P2, MX, FXY, and CXY are output on the receive overhead interface (ROH, ROHSOF, and ROHCLK). The
P1 and P2 bits are output as an error indication (modulo 2 addition of the calculated parity and the bit).
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參數(shù)描述
DS3172N+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Dual DS3/E3 Single Chip Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3173 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Triple DS3/E3 Single Chip Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3173N 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Triple DS3/E3 Single Chip Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3174 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Quad DS3/E3 Single Chip Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3174+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Quad DS3/E3 Single Chip Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray