參數(shù)資料
型號(hào)： AWL9925RD1Q4
廠商： ANADIGICS INC
元件分類： 放大器
英文描述： 2400 MHz - 2500 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER
封裝： 1.90 X 1.67 MM, ROHS COMPLIANT, D1, 19 PIN
文件頁(yè)數(shù)： 11/20頁(yè)
文件大?。?/td> 574K
代理商： AWL9925RD1Q4
Data Sheet - Rev 2.1
12/2007
AWL9925 Die
19
WAFER DIMENSIONS
Wafer dimensions, layout and wafer mark location are shown in Figure 35.
Figure 35: Die Dimensions and Tolerances (Dimensions shown in mm)
MANUFACTURING INFORMATION
ANADIGICS provides 150 mm AWL9925 wafers
with DC die-probe failures clearly marked with ink.
Wafers are marked with bulk material code which is
traceable through wafer processing. Post process
wafers maintain traceability from labels fastened to
the wafer carrier post dicing. ANADIGICS performs
on-wafer DC testing on the AWL9925, as well as visual
inspection after dicing (per ANADIGICS specification
number 60002.003). Maximum chipping specification
is also defined by this specification. Performance is
tested at wafer level using PCM sites. There are 5 PCM
locations uniformly distributed on the wafer. Wafer
tests include NiCr sheet resistivity, MIM capacitor
capacitance and transistor forward transfer current
ratio (Hfe) under different bias conditions.
AWL9925 PURCHASING UNIT
Parts will be purchased as die but shall be shipped in
wafer format on a wafer frame. Parts that pass visual
inspection and DC die-probe tests will be free of ink
markings and can therefore be distinguished from
test failures.
AWL9925 PACKING AND DELIVERY
SPECIFICATIONS
The diced wafers are placed on adhesive tape (Nitto/
Denko P/N SPV224) in a film frame (Perfection
Products P/N FFP-7290-15 or equivalent, ANADIGICS
Part No. 6103), which is shrink-wrapped with desiccant
prior to storage or shipment.
The film frame is to be clearly labeled with the
following information:
1. Item Name
2. Manufacturing Date
3. Expiration Date
4. Manufacturer’s Name
5. Country of Origin
6. Good Die Quantity
Prior to shipment, the individual wafers are placed in
anti-static wafer frame shipping containers (ePAK P/N
EFS6-150-R.3-EM-20 or equivalent, ANADIGICS Part
No. 5430). The film frame cassettes are vacuum sealed
in ESD bags along with desiccant prior to storage or
shipment.
Wafer frame shipment containers are packed in
protective material for shipment. An invoice is included
in each shipping container.
EXTENDED DIE STORAGE
Once the ESD bag is opened (the vacuum seal is
broken),AWL9925 die in the film frame cassette should
be stored in a dry nitrogen environment. The die and
cassette can be stored in dry nitrogen up to 12 months
from the manufacturing date noted on the film frame.
Storage beyond 12 months could cause increased die
adhesion to the film frame tape resulting in damage
during die removal.
0.100 typical (finished)
150±0.3
LASER MARK
LOCATION
(100) FACE
NOTCH
(011)
(010)
(011)
_
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