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參數(shù)資料
| 型號： | 21085 |
| 英文描述： | AMD-K6 Processor I/O Model Application Note AMD-K6 Processor Thermal Solution Design Application Note |
| 中文描述： | 的AMD - K6處理器的I / O模型的應用指南的AMD - K6處理器散熱解決方案設計中的應用說明 |
| 文件頁數(shù)： | 20/22頁 |
| 文件大小： | 335K |
| 代理商： | 21085 |
12
Thermal Evaluation
AMD-K6
Processor Thermal Solution Design
21085I/0—February 1999
Figure 9. Measuring Case Temperature
Thermal Power Utility
A software utility has been developed to assist in testing
thermal solutions. This utility executes a tight loop of
instructions whose addressing and data have been defined to
put the AMD-K6 processor in a state that dissipates the
maximum thermal power. This utility can be used to determine
if a given thermal solution is sufficient to maintain the
specified T
CASE
limit.
To use this utility, execute the DOS program, Maxpwr99.exe as
follows: (
Note:
Do not execute the utility in a DOS window or with
a memory manager loaded.
)
c:\>Maxpwr99.exe
The program executes in an infinite loop until exited. While
executing, the processor’s case temperature can be measured.
In addition, the actual power dissipation should be determined
by measuring the voltage and current supplied to the processor.
Note:
Use a daughter card to allow the processor current to be
measured in series with an Ohmmeter. Take all
measurements close to the processor (use short lead wires).
If the processor power is less than the maximum thermal power
specification, a linear estimate must be used to determine if the
thermal solution maintains the case temperature below its
specified limit.
Thermocouple
Thermally Conductive Epoxy
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