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參數(shù)資料
| 型號： | 21085 |
| 英文描述： | AMD-K6 Processor I/O Model Application Note AMD-K6 Processor Thermal Solution Design Application Note |
| 中文描述： | 的AMD - K6處理器的I / O模型的應(yīng)用指南的AMD - K6處理器散熱解決方案設(shè)計中的應(yīng)用說明 |
| 文件頁數(shù)： | 19/22頁 |
| 文件大?。?/td> | 335K |
| 代理商： | 21085 |
Thermal Evaluation
11
21085I/0—February 1999
AMD-K6
Processor Thermal Solution Design
Figure 8. Standard Mid-Tower Case
Thermal Evaluation
Measuring Case Temperature
The processor case temperature is measured to ensure that the
thermal solution meets the processor’s operational
specification. This temperature should be measured on the top
center of the package where most of the heat is dissipated.
Figure 9 on page 12 shows the correct location for measuring
the case temperature. If a heatsink is installed while
measuring, the thermocouple must be installed into the
heatsink via a small hole drilled through the heatsink base (for
example, 1/16 of an inch). The thermocouple is then attached to
the base of the heatsink and the small hole filled using thermal
epoxy, allowing the tip of the thermocouple to touch the top of
the processor case.
Fan
Power
Supply
Box Fan
AMD-K6
Processor
Regulator
Heatsink
Drive Bays
Box Fan
Inside Ambient
Thermocouple
Front
Rear
Intake Vent
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