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| 型號： | 21085 |
| 英文描述： | AMD-K6 Processor I/O Model Application Note AMD-K6 Processor Thermal Solution Design Application Note |
| 中文描述： | 的AMD - K6處理器的I / O模型的應(yīng)用指南的AMD - K6處理器散熱解決方案設(shè)計(jì)中的應(yīng)用說明 |
| 文件頁數(shù)： | 17/22頁 |
| 文件大小： | 335K |
| 代理商： | 21085 |
Layout and Airflow Considerations
9
21085I/0—February 1999
AMD-K6
Processor Thermal Solution Design
Airflow Management in the ATX Form Factor
Figure 7 shows the airflow management in a system using the
ATX form-factor. The orientation of the power supply fan and
the motherboard are modified in the ATX platform design. The
power supply fan generates airflow through the chassis and
across the processor. The processor is located near the power
supply fan where it can receive maximum airflow without an
auxiliary fan. This arrangement significantly improves the
airflow across the processor with minimum installation cost.
Figure 7. Airflow Path in an ATX Form-Factor System
Additional Box Fans
Additional box fans can enhance the effectiveness of the
airflow within the chassis. Table 2 on page 10 summarizes the
effect of different numbers and configurations of box fans in
the chassis. The purpose of the box fans is to improve
circulation of air within the chassis. The box fans used in this
experiment were chosen to fit the existing mountings in the
chassis. The front fan is an 80-mm 35-CFM fan and the rear fan
is a 60-mm 25-CFM fan. The goal of better circulation is to
reduce the ambient temperature inside the chassis.
P/S
Main Board
Drive Bays
Fa
n
Air Vents
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