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參數(shù)資料
| 型號： | 21085 |
| 英文描述： | AMD-K6 Processor I/O Model Application Note AMD-K6 Processor Thermal Solution Design Application Note |
| 中文描述： | 的AMD - K6處理器的I / O模型的應(yīng)用指南的AMD - K6處理器散熱解決方案設(shè)計中的應(yīng)用說明 |
| 文件頁數(shù)： | 13/22頁 |
| 文件大?。?/td> | 335K |
| 代理商： | 21085 |
Thermal Solutions
5
21085I/0—February 1999
AMD-K6
Processor Thermal Solution Design
Figure 3. CPGA Package Thermal Resistance Model
Interface Materials
The interface material used between the heatsink and
processor is important. The purpose of this material is to fill any
microscopic air gaps and ensure a thermally efficient path is
established for heat to flow from the package into the heatsink.
There are several different types of thermally conductive
interface material in use today. The most common are grease,
wax, thermal pads/tapes, and epoxy. While dry interfaces (pads
and tapes) are often the easiest to use, they have the poorest
thermal resistance. They are not recommended because small
pockets of air can be trapped during installation. Wet or paste
interfaces (grease, gel, wax, and epoxy) have lower thermal
resistances and allow air bubbles to migrate out of the interface
material.
Although epoxy, when handled correctly, can provide a
reasonable thermal interface, it is not a reliable mechanical
attachment. Caution should also be taken with pre-applied
waxes, because pockets of air (a poor thermal conductor) can be
Print-Circuit Board
ZIF Socket
Heat Sink
Thermal Interface Material
Die
Thin Lid
Ceramic substrate
Heat Sink Clip
Radiation
Convection
Radiation
Convection
Print-Circuit Board and Socket
Heat Sink
Thermal Interface Material
Thin Lid and Grease
Silicon
C4 Bumps
Ceramc Substrate
Package Pins
Underfill
Chip Junction
Primary Heat Dissipation Path
Secondary Heat Dissipation Path
PGA Package
External Resistance
External Resistance
Ambient
Case Temperature
Junction Temperature
θ
JC
θ
CA
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