參數(shù)資料
型號: XRT75R03DIV
廠商: Exar Corporation
文件頁數(shù): 4/135頁
文件大?。?/td> 0K
描述: IC LIU E3/DS3/STS-1 3CH 128LQFP
標(biāo)準(zhǔn)包裝: 72
類型: 線路接口裝置(LIU)
驅(qū)動(dòng)器/接收器數(shù): 3/3
規(guī)程: DS3,E3,STS-1
電源電壓: 3.135 V ~ 3.465 V
安裝類型: 表面貼裝
封裝/外殼: 128-LQFP
供應(yīng)商設(shè)備封裝: 128-LQFP(14x20)
包裝: 托盤
XRT75R03D
97
REV. 1.0.4
THREE CHANNEL E3/DS3/STS-1 LINE
In general, the role/purpose of the POH bytes is to fulfill the following functions.
To support error detection within the STS-1 SPE
To support the transmission of various alarm conditions such as RDI-P (Path - Remote Defect Indicator) and
REI-P (Path - Remote Error Indicator)
To support the transmission and reception of "Path Trace" Messages
The role of the POH bytes is beyond the scope of this data sheet and will not be discussed any further.
10.2.1.2
Mapping DS3 data into an STS-1 SPE
Now that we have defined the STS-1 SPE, we can now describe how a DS3 signal is mapped into an STS-1
SPE. As mentioned above, the STS-1 SPE is basically an 87 byte column x 9 row structure of data. The very
first byte column (e.g., in all 9 bytes) consists of the POH (Path Overhead) bytes. All of the remaining bytes
within the STS-1 SPE is simply referred to as "user" or "payload" data because this is the portion of the STS-1
signal that is used to transport "user data" from one end of the SONET network to the other. Telcordia GR-
253-CORE specifies the approach that one must use to asynchronously map DS3 data into an STS-1 SPE. In
short, this approach is presented below in Figure 37.
FIGURE 36. ILLUSTRATION OF THE BYTE STRUCTURE OF THE STS-1 SPE
Z5
Z4
Z3
H4
F2
G1
C2
B3
J1
Payload (or User) Data
86 Bytes
1 Byte
87 Bytes
9 Rows
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XRT75R03DIV-F 功能描述:網(wǎng)絡(luò)控制器與處理器 IC 3-Ch E3/DS3/STS-1 RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流(最大值):595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
XRT75R03DIVTR 功能描述:時(shí)鐘合成器/抖動(dòng)清除器 3CHNNEL E3/DS3/STS 1 JITTER ATTENUATOR RoHS:否 制造商:Skyworks Solutions, Inc. 輸出端數(shù)量: 輸出電平: 最大輸出頻率: 輸入電平: 最大輸入頻率:6.1 GHz 電源電壓-最大:3.3 V 電源電壓-最小:2.7 V 封裝 / 箱體:TSSOP-28 封裝:Reel
XRT75R03DIVTR-F 功能描述:接口 - 專用 RoHS:否 制造商:Texas Instruments 產(chǎn)品類型:1080p60 Image Sensor Receiver 工作電源電壓:1.8 V 電源電流:89 mA 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:BGA-59
XRT75R03ES 功能描述:時(shí)鐘合成器/抖動(dòng)清除器 3CH T3/E3/STS1LIU+JA 3.3V W/REDUNDANCY RoHS:否 制造商:Skyworks Solutions, Inc. 輸出端數(shù)量: 輸出電平: 最大輸出頻率: 輸入電平: 最大輸入頻率:6.1 GHz 電源電壓-最大:3.3 V 電源電壓-最小:2.7 V 封裝 / 箱體:TSSOP-28 封裝:Reel
XRT75R03IV 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI 3CHNNEL E3/DS3/STS 1 JITTER ATTENUATOR RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray