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| 型號(hào)： | XRT75R03DIV |
| 廠商： | Exar Corporation |
| 文件頁(yè)數(shù)： | 3/135頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC LIU E3/DS3/STS-1 3CH 128LQFP |
| 標(biāo)準(zhǔn)包裝： | 72 |
| 類型： | 線路接口裝置（LIU） |
| 驅(qū)動(dòng)器/接收器數(shù)： | 3/3 |
| 規(guī)程： | DS3，E3，STS-1 |
| 電源電壓： | 3.135 V ~ 3.465 V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 128-LQFP |
| 供應(yīng)商設(shè)備封裝： | 128-LQFP（14x20） |
| 包裝： | 托盤 |
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XRT75R03D
96
THREE CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT WITH SONET DESYNCRONIZER
REV. 1.0.4
Although the role of the H1, H2 and H3 bytes will be discussed in much greater detail in “Section 10.3, Jitter/
Wander due to Pointer Adjustments” on page 103
. For now, we will simply state that the role of these bytes
is two-fold.
To permit a given PTE (Path Terminating Equipment) that is receiving an STS-1 data to be able to locate the
STS-1 SPE (Synchronous Payload Envelope) within the Envelope Capacity of this incoming STS-1 data
stream and,
To inform a given PTE whenever Pointer Adjustment and NDF (New Data Flag) events occur within the
incoming STS-1 data-stream.
10.2.1.1.2
The Envelope Capacity Bytes within an STS-1 Frame
In general, the Envelope Capacity Bytes are any bytes (within an STS-1 frame) that exist outside of the TOH
bytes. In short, the Envelope Capacity contains the STS-1 SPE (Synchronous Payload Envelope). In fact,
every single byte that exists within the Envelope Capacity also exists within the STS-1 SPE.
The only
difference that exists between the "Envelope Capacity" as defined in Figure 34 and Figure 35 above and the
STS-1 SPE is that the Envelope Capacity is aligned with the STS-1 framing boundaries and the TOH bytes;
whereas the STS-1 SPE is NOT aligned with the STS-1 framing boundaries, nor the TOH bytes.
The STS-1 SPE is an "87 byte column x 9 row" data-structure (which is the exact same size as is the Envelope
Capacity) that is permitted to "float" within the "Envelope Capacity". As a consequence, the STS-1 SPE (within
an STS-1 data-stream) will typically straddle across an STS-1 frame boundary.
10.2.1.1.3
The Byte Structure of the STS-1 SPE
As mentioned above, the STS-1 SPE is an 87 byte column x 9 row structure. The very first column within the
STS-1 SPE consists of some overhead bytes which are known as the "Path Overhead" (or POH) bytes. The
remaining portions of the STS-1 SPE is available for "user" data. The Byte Structure of the STS-1 SPE is
presented below in Figure 36.
FIGURE 35. THE BYTE-FORMAT OF THE TOH WITHIN AN STS-1 FRAME
A1
B1
D1
H1
B2
D4
S1
D10
D7
C1
F1
D3
H3
K2
D6
E2
D12
D9
A2
E1
D2
H2
K1
D5
M0
D11
D8
Envelope Capacity
Bytes
Envelope Capacity
Bytes
3 Byte Columns
87 Byte Columns
9 Rows
The TOH Bytes
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XRT75R03DIV-F | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC 3-Ch E3/DS3/STS-1 RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| XRT75R03DIVTR | 功能描述:時(shí)鐘合成器/抖動(dòng)清除器 3CHNNEL E3/DS3/STS 1 JITTER ATTENUATOR RoHS:否 制造商:Skyworks Solutions, Inc. 輸出端數(shù)量: 輸出電平: 最大輸出頻率: 輸入電平: 最大輸入頻率:6.1 GHz 電源電壓-最大:3.3 V 電源電壓-最小:2.7 V 封裝 / 箱體:TSSOP-28 封裝:Reel |
| XRT75R03DIVTR-F | 功能描述:接口 - 專用 RoHS:否 制造商:Texas Instruments 產(chǎn)品類型:1080p60 Image Sensor Receiver 工作電源電壓:1.8 V 電源電流:89 mA 最大功率耗散: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:BGA-59 |
| XRT75R03ES | 功能描述:時(shí)鐘合成器/抖動(dòng)清除器 3CH T3/E3/STS1LIU+JA 3.3V W/REDUNDANCY RoHS:否 制造商:Skyworks Solutions, Inc. 輸出端數(shù)量: 輸出電平: 最大輸出頻率: 輸入電平: 最大輸入頻率:6.1 GHz 電源電壓-最大:3.3 V 電源電壓-最小:2.7 V 封裝 / 箱體:TSSOP-28 封裝:Reel |
| XRT75R03IV | 功能描述:外圍驅(qū)動(dòng)器與原件 - PCI 3CHNNEL E3/DS3/STS 1 JITTER ATTENUATOR RoHS:否 制造商:PLX Technology 工作電源電壓: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FCBGA-1156 封裝:Tray |
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