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參數(shù)資料
| 型號(hào)： | W25X32AVZPIG |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | PROM |
| 英文描述： | 4M X 8 FLASH 2.7V PROM, PDSO8 |
| 封裝： | 6 X 5 MM, GREEN, WSON-8 |
| 文件頁(yè)數(shù)： | 20/45頁(yè) |
| 文件大小： | 1308K |
| 代理商： | W25X32AVZPIG |
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W25X32A
Publication Release Date: August 7, 2009
- 27 -
Preliminary - Revision B
10.2.15 Release Power-down / Device ID (ABh)
The Release from Power-down / Device ID instruction is a multi-purpose instruction. It can be used to
release the device from the power-down state, obtain the devices electronic identification (ID) number or
do both.
When used only to release the device from the power-down state, the instruction is issued by driving the
/CS pin low, shifting the instruction code “ABh” and driving /CS high as shown in figure 16. After the time
duration of tRES1 (See AC Characteristics) the device will resume normal operation and other instructions
will be accepted. The /CS pin must remain high during the tRES1 time duration.
When used only to obtain the Device ID while not in the power-down state, the instruction is initiated by
driving the /CS pin low and shifting the instruction code “ABh” followed by 3-dummy bytes. The Device ID
bits are then shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in figure
17. The Device ID value for the W25X32A is listed in Manufacturer and Device Identification table. The
Device ID can be read continuously. The instruction is completed by driving /CS high.
When used to release the device from the power-down state and obtain the Device ID, the instruction is
the same as previously described, and shown in figure 17, except that after /CS is driven high it must
remain high for a time duration of tRES2 (See AC Characteristics). After this time duration the device will
resume normal operation and other instructions will be accepted.
If the Release from Power-down / Device ID instruction is issued while an Erase, Program or Write cycle
is in process (when BUSY equals 1) the instruction is ignored and will not have any effects on the current
cycle
Figure 16. Release Power-down Instruction Sequence
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| W25X32AVSFIG | 4M X 8 FLASH 2.7V PROM, PDSO16 |
| W26L04AJ-12I | 256K X 16 STANDARD SRAM, 12 ns, PDSO44 |
| W26L04AH-10 | 256K X 16 STANDARD SRAM, 10 ns, PDSO44 |
| W28A | CERPAC, 28 LEAD |
| W2H11A1018AT | 1 FUNCTIONS, 100 V, 0.5 A, FEED THROUGH CAPACITOR |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W25X32BV | 制造商:WINBOND 制造商全稱:Winbond 功能描述:32M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
| W25X32BVSFIG | 制造商:WINBOND 制造商全稱:Winbond 功能描述:32M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
| W25X32BVSSIG | 制造商:WINBOND 制造商全稱:Winbond 功能描述:32M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
| W25X32BVZEIG | 制造商:WINBOND 制造商全稱:Winbond 功能描述:32M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
| W25X32BVZPIG | 制造商:WINBOND 制造商全稱:Winbond 功能描述:32M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
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