參數(shù)資料
型號: W25Q80BVSFIG
廠商: WINBOND ELECTRONICS CORP
元件分類: PROM
英文描述: 1M X 8 SPI BUS SERIAL EEPROM, PDSO16
封裝: 0.300 INCH, GREEN, PLASTIC, SOIC-16
文件頁數(shù): 62/72頁
文件大?。?/td> 1878K
代理商: W25Q80BVSFIG
W25Q80BV
Publication Release Date: March 26, 2009
- 65 -
Preliminary - Revision A
12. PACKAGE SPECIFICATION
12.1 8-Pin SOIC 150-mil (Package Code SN)
MILLIMETERS
INCHES
SYMBOL
MIN
TYP.
MAX
MIN
TYP.
MAX
A
1.47
1.60
1.72
0.058
0.063
0.068
A1
0.10
---
0.24
0.004
---
0.009
A2
---
1.45
---
0.057
---
b
0.33
0.41
0.50
0.013
0.016
0.020
C
0.19
0.20
0.25
0.0075
0.008
0.0098
D(3)
4.80
4.85
4.95
0.189
0.191
0.195
E
5.80
6.00
6.19
0.228
0.236
0.244
E1(3)
3.80
3.90
4.00
0.150
0.154
0.157
e(2)
1.27 BSC
0.050 BSC
L
0.40
0.71
1.27
0.015
0.028
0.050
0o
---
8o
0o
---
8o
CP
---
0.10
---
0.004
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the
package.
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.
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