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參數(shù)資料
| 型號： | W25Q80BLSSIP |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | PROM |
| 英文描述： | 8M X 1 SPI BUS SERIAL EEPROM, PDSO8 |
| 封裝： | 5.28 MM, GREEN, PLASTIC, SOIC-8 |
| 文件頁數(shù)： | 73/75頁 |
| 文件大小： | 2267K |
| 代理商： | W25Q80BLSSIP |
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W25Q80BL
Publication Release Date: July 08, 2010
- 75 -
Preliminary - Revision C
13. REVISION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A
03/26/09
New Create Preliminary
B
08/20/09
5-8, 45 & 46,
65-71
53
Removed SOIC-16 package
Added PDIP-8 package
Updated package diagrams
Updated Suspend/Resume description
Corrected UID waveform
C
07/08/10
50, 54
63, 66
68-71
5, 9, 20, 55-57
Updated 90h & 9Fh waveforms
Updated parameter VIL/VIH, tSE, tPP
Updated package diagrams
Added SFDP feature
Preliminary Designation
The “Preliminary” designation on a Winbond datasheet indicates that the product is not fully
characterized. The specifications are subject to change and are not guaranteed. Winbond or an
authorized sales representative should be consulted for current information before using this product.
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems
or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for
other applications intended to support or sustain life. Further more, Winbond products are not intended
for applications wherein failure of Winbond products could result or lead to a situation wherein personal
injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk
and agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W25Q80BLSVIG | 制造商:Winbond Electronics Corp 功能描述:8MB SERIAL FLASH MEMORY |
| W25Q80BLZPIG | 制造商:Winbond Electronics Corp 功能描述:FLASH |
| W25Q80BLZPIGTR | 功能描述:IC MEM FLASH 8M SPI 8-WSON RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:SpiFlash® 標(biāo)準(zhǔn)包裝:2,000 系列:- 格式 - 存儲器:RAM 存儲器類型:SRAM - 異步 存儲容量:256K (32K x 8) 速度:15ns 接口:并聯(lián) 電源電壓:3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:28-TSSOP（0.465"，11.8mm 寬） 供應(yīng)商設(shè)備封裝:28-TSOP 包裝:帶卷 (TR) 其它名稱:71V256SA15PZGI8 |
| W25Q80BLZPIP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:2.5V 8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q80BV | 制造商:WINBOND 制造商全稱:Winbond 功能描述:8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
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