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參數(shù)資料
| 型號： | VSC8140TW |
| 廠商： | VITESSE SEMICONDUCTOR CORP |
| 元件分類： | 數(shù)字傳輸電路 |
| 英文描述： | 2.48832Gb/s 16:1 SONET/SDH Transceiver with Integrated Clock Generator |
| 中文描述： | TRANSCEIVER, PBGA208 |
| 封裝： | 23 X 23 MM, THERMALLY ENHANCED, TBGA-208 |
| 文件頁數(shù)： | 32/34頁 |
| 文件大?。?/td> | 528K |
| 代理商： | VSC8140TW |
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VITESSE
Data Sheet
VSC8140
2.48832Gb/s 16:1 SONET/SDH
Transceiver with Integrated Clock Generator
Page 32
VITESSE
SEMICONDUCTOR CORPORATION
741 Calle Plano, Camarillo, CA 93012 805/388-3700 FAX: 805/987-5896
9/6/00
G52251-0, Rev. 4.0
Package Thermal Considerations
This package has been enhanced with a copper heat slug to provide a low thermal resistance path from the
die to the exposed surface of the heat spreader. The thermal resistance is shown in the following table:
Table 6: Thermal Resistance
Thermal Resistance with Airflow
Shown in the table below is the thermal resistance with airflow. This thermal resistance value reflects all the
thermal paths including through the leads in an environment where the leads are exposed. The temperature dif-
ference between the ambient airflow temperature and the case temperature should be the worst case power of
the device multiplied by the thermal resistance.
Table 7: Thermal Resistance with Airflow
Maximum Ambient Temperature without Heatsink
The worst case ambient temperature without use of a heatsink is given by the equation:
T
A MAX
)
where:
θ
CA
Theta case to ambient at appropriate airflow
Τ
A(MAX)
Ambient Air temperature
Τ
C(MAX
)
Case temperature (110
o
C for VSC8140)
P
(MAX)
Power (2.75 W for VSC8140)
Symbol
Description
°
C/W - (BGA)
°
C/W (PQFP)
θ
jc
Thermal resistance from junction to case.
Thermal resistance from case to ambient with no airflow,
including conduction through the leads.
2.2
1.34
θ
ca
18.5
25.0
Airflow
θ
ca
(
o
C/W
) (BGA)
18
17
16
θ
ca
(
o
C/W
) (PQFP)
21
18
16
100 lfpm
200 lfpm
400 lfpm
T
C MAX
)
P
–
MAX
(
)
θ
CA
=
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