參數(shù)資料
型號: VP230
廠商: Texas Instruments, Inc.
元件分類: CAN
英文描述: 3.3-V CAN TRANSCEIVERS
中文描述: 3.3 V的CAN收發(fā)器
文件頁數(shù): 26/32頁
文件大?。?/td> 403K
代理商: VP230
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
SOIC
Package
Drawing
D
Pins Package
Qty
75
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
SN65HVD230D
ACTIVE
8
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
75
Green (RoHS &
no Sb/Br)
75
Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
75
Green (RoHS &
no Sb/Br)
75
Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN65HVD230DG4
ACTIVE
SOIC
D
8
75
CU NIPDAU
Level-1-260C-UNLIM
SN65HVD230DR
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
SN65HVD230DRG4
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
SN65HVD231D
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
SN65HVD231DG4
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
SN65HVD231DR
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
SN65HVD231DRG4
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
SN65HVD232D
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
SN65HVD232DG4
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
SN65HVD232DR
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
SN65HVD232DRG4
ACTIVE
SOIC
D
8
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:
The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com
29-Sep-2006
Addendum-Page 1
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