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參數(shù)資料
| 型號： | UPD72107 |
| 廠商： | NEC Corp. |
| 英文描述： | LAP-B CONTROLLER(Link Access Procedure Balanced mode) |
| 中文描述： | 鱲- B控制器（鏈路訪問過程平衡模式） |
| 文件頁數(shù)： | 28/32頁 |
| 文件大小： | 182K |
| 代理商： | UPD72107 |
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28
μ
PD72107
6. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD72107 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device
Mounting Technology Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact your NEC sales representative.
Surface mounting type
μ
PD72107GC-3B9: 80-pin plastic QFP (14
×
14 mm)
Soldering Method
Soldering Conditions
Recommended Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 sec. Max.
(at 210
°
C or higher), Count: three times or less
IR35-00-3
VPS
Package peak temperature: 215
°
C, Time: 40 sec. Max.
(at 200
°
C or higher), Count: three times or less
VP15-00-3
Wave soldering
Solder bath temperature: 260
°
C, Time: 10 sec. Max.,
Count: one time, Preheating temperature: 120
°
C Max.
(package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 300
°
C Max., Duration: 3 sec. Max. (per pin row)
–
Caution Do not use different soldering methods together (except for partial heating).
μ
PD72107L: 68-pin plastic QFJ (950
×
950 mils)
Soldering Method
Soldering Conditions
Recommended Condition Symbol
VPS
Package peak temperature: 215
°
C, Time: 40 sec. Max.
(at 200
°
C or higher), Count: one time
VP15-00-1
Partial heating
Pin temperature: 300
°
C Max., Duration: 3 sec. Max. (per pin row)
–
Insertion type
μ
PD72107CW: 64-pin plastic shrink DIP (750 mils)
Soldering Method
Soldering Conditions
Wave soldering (pin only)
Solder bath temperature: 260
°
C Max., Time: 10 sec. Max.
Partial heating
Pin temperature: 300
°
C Max., Duration: 3 sec. Max. (per a pin)
Caution Wave soldering must be applied only to pins. Be sure to avoid jet soldering the package body.
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