參數(shù)資料
型號: UPD703032AYGF-XXX-3BA
元件分類: 微控制器/微處理器
英文描述: 32-BIT, MROM, 20 MHz, MICROCONTROLLER, PQFP100
封裝: 14 X 20 MM, PLASTIC, QFP-100
文件頁數(shù): 41/54頁
文件大?。?/td> 507K
代理商: UPD703032AYGF-XXX-3BA
Data Sheet U14893EJ2V0DS
44
PD703032A, 703032AY, 70F3032A, 70F3032AY
5. RECOMMENDED SOLDERING CONDITIONS
The
PD703032A, 703032AY, 70F3032A, and 70F3032AY should be soldered and mounted under the following
recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 5-1. Surface Mounting Type Soldering Conditions (1/2)
(1)
PD703032AGF-×××
×××
×××-3BA: 100-pin plastic QFP (14 ×××× 20)
PD703032AYGF-×××
×××
×××-3BA: 100-pin plastic QFP (14 ×××× 20)
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 235 °C, Time: 30 seconds max. (at 210 °C or higher),
Count: Two times or less
Exposure limit: 7 days
Note (after that, prebake at 125 °C for 20 to 72 hours)
IR35-207-2
VPS
Package peak temperature: 215 °C, Time: 25 to 40 seconds (at 200 °C or higher),
Count: Two times or less
Exposure limit: 7 days
Note (after that, prebake at 125 °C for 20 to 72 hours)
VP15-207-2
Wave soldering
Solder bath temperature: 260 °C max., Time: 10 seconds max., Count: Once
Preheating temperature: 120 °C max. (package surface temperature)
Exposure limit: 7 days
Note (after that, prebake at 125 °C for 20 to 72 hours)
WS60-207-1
Partial heating
Pin temperature: 300 °C max., Time: 3 seconds max. (per pin row)
Note After opening the dry pack, store it at 25 °C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
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