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參數(shù)資料
| 型號： | UPD6604 |
| 廠商： | NEC Corp. |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCONTROLLER FOR INFRARED REMOTE CONTROL TRANSMISSION |
| 中文描述： | 4位單片機的紅外遙控傳輸 |
| 文件頁數(shù)： | 57/64頁 |
| 文件大?。?/td> | 268K |
| 代理商： | UPD6604 |
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57
μ
PD6604
Data Sheet U11281EJ3V0DS00
15. RECOMMENDED SOLDERING CONDITIONS
Carry out the soldered packaging of this product under the following recommended conditions.
For details of the soldering conditions, refer to information material
Semiconductor Device Mounting
Technology Manual (C10535E)
.
For soldering methods and conditions other than the recommended conditions, please consult one of our NEC
sales representatives.
Table 15-1. Soldering Conditions for Surface-Mount Type
μ
PD6604GS-
×××
μ
PD6604GS-
×××
-GJG : 20-pin plastic shrink SOP (300 mil)
: 20-pin plastic SOP (300 mil)
Soldering Method
Soldering Condition
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C; time: 30 secs. max. (210
°
C or higher);
count: no more than twice
IR35-00-2
VPS
Package peak temperature: 215
°
C; time: 40 secs. max. (200
°
C or higher);
count: no more than twice
VP15-00-2
Wave soldering
Solder bath temperature: 260
°
C max.; time: 10 secs. max.; count: once
Preliminary heat temperature: 120
°
C max. (Package surface temperature)
Pin temperature: 300
°
C or less; time: 3 secs or less (for each side of the device)
WS60-00-1
Partial heating
—
Caution Using more than one soldering method should be avoided (except in the case of partial heating).
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPD6604GS | 制造商:NEC 制造商全稱:NEC 功能描述:4-BIT SINGLE-CHIP MICROCONTROLLER FOR INFRARED REMOTE CONTROL TRANSMISSION |
| UPD6604GS-XXX | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROCONTROLLER|4-BIT|CMOS|SOP|20PIN|PLASTIC |
| UPD6604GS-XXX-GJG | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:4-Bit Microcontroller |
| UPD66207F1-Y02-FN7-SES-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD66P04AGS | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:4-Bit Microcontroller |
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