參數(shù)資料
型號(hào)： UDA1361TS/N1,112
廠商： NXP SEMICONDUCTORS
元件分類(lèi)： ADC
英文描述： 96 kHz sampling 24-bit stereo audio ADC; Package: SOT369-1 (SSOP16); Container: Tube
中文描述： 2-CH 24-BIT DELTA-SIGMA ADC, SERIAL ACCESS, PDSO16
封裝： 4.40 MM, PLASTIC, SOT369-1, SSOP-16
文件頁(yè)數(shù)： 6/20頁(yè)
文件大?。?/td> 100K
代理商： UDA1361TS/N1,112
2002 Nov 25
14
Philips Semiconductors
Product specication
96 kHz sampling 24-bit stereo audio ADC
UDA1361TS
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
Reow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 250
°C. The top-surface temperature of the
packages should preferable be kept below 220
°C for
thick/large packages, and below 235
°C for small/thin
packages.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
For packages with leads on four sides, the footprint must
be placed at a 45
° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250
°C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
°C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320
°C.
相關(guān)PDF資料
PDF描述
UDA1361TS/N1,118 96 kHz sampling 24-bit stereo audio ADC; Package: SOT369-1 (SSOP16); Container: Reel Pack, SMD, 13"
UDA1380HN/N2,118 Stereo audio coder-decoder for MD, CD and MP3; Package: SOT617-1 (HVQFN32); Container: Reel Pack, SMD, 13"
UDA1380TT Stereo audio coder-decoder for MD, CD and MP3
UEA1119C-HFD5-4F 9 CONTACT(S), FEMALE, RIGHT ANGLE TELECOM AND DATACOM CONNECTOR, SOLDER
UER100MF2XF 100 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
UDA1380 制造商:ICS 制造商全稱(chēng):ICS 功能描述:Stereo audio coder-decoder for MD, CD and MP3
UDA1380HN 制造商:ICS 制造商全稱(chēng):ICS 功能描述:Stereo audio coder-decoder for MD, CD and MP3
UDA1380HN/N2 制造商:NXP Semiconductors 功能描述:IC CODEC AUDIO MINIDISC 32HVQFN 制造商:NXP Semiconductors 功能描述:IC, CODEC, AUDIO, MINIDISC, 32HVQFN
UDA1380HN/N2,118 功能描述:接口—CODEC STEREO AUDIO RoHS:否 制造商:Texas Instruments 類(lèi)型: 分辨率: 轉(zhuǎn)換速率:48 kSPs 接口類(lèi)型:I2C ADC 數(shù)量:2 DAC 數(shù)量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel
UDA1380HN-T 功能描述:接口—CODEC STEREO AUDIO CODER-DECODER RoHS:否 制造商:Texas Instruments 類(lèi)型: 分辨率: 轉(zhuǎn)換速率:48 kSPs 接口類(lèi)型:I2C ADC 數(shù)量:2 DAC 數(shù)量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel
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