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4–4

4.2

Designing With PowerPAD

The TVP5031 is housed in a high-performance, thermally enhanced, 80-pin PowerPAD package (TI package

designator: 80PFP). Use of the PowerPAD package does not require any special considerations except to note that

the PowerPAD, which is an exposed die pad on the bottom of the device, is a metallic thermal and electrical conductor.

Therefore, if not implementing the PowerPAD PCB features, the use of solder masks (or other assembly techniques)

may be required to prevent any inadvertent shorting by the exposed PowerPAD of connection etches or vias under

the package. The recommended option, however, is not to run any etches or signal vias under the device, but to have

only a grounded thermal land as explained below.

It is recommended that there be a thermal land, which is an area of solder-tinned-copper, underneath the PowerPAD

package. The thermal land will vary in size, depending on the PowerPAD package being used, the PCB construction,

and the amount of heat that needs to be removed. In addition, the thermal land may or may not contain numerous

thermal vias depending on PCB construction.

More information on the package and other requirements for using thermal lands and thermal vias are detailed in the

TI application note PowerPAD Thermally Enhanced Package Application Report, TI literature number SLMA002,

available via the TI Web pages beginning at URL: http://www.ti.com

For the TVP5031, this thermal land should be grounded to the low impedance ground plane of the device. This

improves not only thermal performance but also the electrical grounding of the device. It is also recommended that

the device ground terminal landing pads be connected directly to the grounded thermal land. The land size should

be as large as possible without shorting device signal terminals. The thermal land may be soldered to the exposed

PowerPAD using standard reflow soldering techniques.

While the thermal land may be electrically floated and configured to remove heat to an external heat sink, it is

recommended that the thermal land be connected to the low impedance ground plane for the device.

PowerPAD is a trademark of Texas Instruments.

相關(guān)代理商/技術(shù)參數(shù)	參數(shù)描述
TVP5031TQFP	制造商:TI 制造商全稱:Texas Instruments 功能描述:NTSC/PAL VIDEO DECODER
TVP5040	制造商:TI 制造商全稱:Texas Instruments 功能描述:NTSC/PAL Digital Video Decoder With Macrovision Detection
TVP5040CPFP	功能描述:IC NTSC/PAL VIDEO DECODER 80TQFP RoHS:是類別:集成電路 (IC) >> 接口 - 編碼器，解碼器，轉(zhuǎn)換器系列:- 產(chǎn)品變化通告:Development Systems Discontinuation 26/Apr/2011 標(biāo)準(zhǔn)包裝:1 系列:- 類型:編碼器應(yīng)用:DVB-S.2 系統(tǒng) 電壓 - 電源，模擬:- 電壓 - 電源，數(shù)字:- 安裝類型:- 封裝/外殼:模塊供應(yīng)商設(shè)備封裝:模塊包裝:散裝其它名稱:Q4645799
TVP5040CPFPG4	功能描述:IC NTSC/PAL VIDEO DECODER 80TQFP RoHS:是類別:集成電路 (IC) >> 接口 - 編碼器，解碼器，轉(zhuǎn)換器系列:- 產(chǎn)品變化通告:Development Systems Discontinuation 26/Apr/2011 標(biāo)準(zhǔn)包裝:1 系列:- 類型:編碼器應(yīng)用:DVB-S.2 系統(tǒng) 電壓 - 電源，模擬:- 電壓 - 電源，數(shù)字:- 安裝類型:- 封裝/外殼:模塊供應(yīng)商設(shè)備封裝:模塊包裝:散裝其它名稱:Q4645799
TVP5040EVM	制造商:Texas Instruments 功能描述:EVAL BD TVP5040EVM USER S GUIDE - Bulk

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