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參數(shù)資料
| 型號： | TS83102G0BVGL |
| 廠商： | E2V TECHNOLOGIES PLC |
| 元件分類： | ADC |
| 英文描述： | 1-CH 10-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CBGA152 |
| 封裝： | 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-152 |
| 文件頁數(shù)： | 9/60頁 |
| 文件大?。?/td> | 1510K |
| 代理商： | TS83102G0BVGL |
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17
0830E–BDC–06/07
e2v semiconductors SAS 2007
TS83102G0B
9.
Thermal and Moisture Characteristics
9.1
Dissipation by Conduction and Convection
The thermal resistance from junction to ambient RTH
JA is around 30°C/W. Therefore, to lower RTHJA, it
is mandatory to use an external heat sink to improve dissipation by convection and conduction. The heat
sink should be fixed in contact with the top side of the package (CuW heat spreader over Al2O3) which is
at -5V.
The heat sink needs to be electrically isolated, using adequate low RTH electrical isolation.
Example:
The thermal resistance from case to ambient RTH
CA is typically 4.0°C/W (0 m/s air flow or still air)
with the heat sink depicted in Figure 9-1 on page 18, of dimensions 50 mm x 50 mm x 22 mm
(respectively L x l x H).
The global junction to ambient thermal resistance RTH
JA is:
4.35
°C/W RTH
JC + 2.0°C/W thermal grease resistance + 4.0°C/W RTHCA (case to ambient) =
10.35
°C/W total (RTH
JA).
Assuming:
A typical thermal resistance from the junction to the bottom of the case RTH
JC of 4.35°C/W (finite
element method thermal simulation results): this value does not include the thermal contact resis-
tance between the package and the external heat sink (glue, paste, or thermal foil interface, for
example). As an example, use a 2.0
°C/W value for a
50 m thickness of thermal grease.
Note:
Example of the calculation of the ambient temperature T
A max to ensure TJ max = 110°C:
assuming RTH
JA = 10.35°C/W and power dissipation = 4.6 W, TA max = TJ - (RTHJA x 4.6 W) = 110 -
(10.35 x 4.6) = 62.39
°C. T
A max can be increased by lowering RTHJA with an adequate air flow ( 2 m/s, for
example).
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TS83102G0CGL | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Analog to Digital Converter |
| TS83102G0GSZR5 | 制造商:e2v technologies 功能描述:TS83102G0GSZR5 - Trays |
| TS831-3I | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:MICROPOWER VOLTAGE SUPERVISOR RESET ACTIVE LOW |
| TS831-3ID | 功能描述:監(jiān)控電路 2.71V Micropower AL RoHS:否 制造商:STMicroelectronics 監(jiān)測電壓數(shù): 監(jiān)測電壓: 欠電壓閾值: 過電壓閾值: 輸出類型:Active Low, Open Drain 人工復(fù)位:Resettable 監(jiān)視器:No Watchdog 電池備用開關(guān):No Backup 上電復(fù)位延遲（典型值）:10 s 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UDFN-6 封裝:Reel |
| TS831-3IDT | 功能描述:監(jiān)控電路 2.71V Micropower AL RoHS:否 制造商:STMicroelectronics 監(jiān)測電壓數(shù): 監(jiān)測電壓: 欠電壓閾值: 過電壓閾值: 輸出類型:Active Low, Open Drain 人工復(fù)位:Resettable 監(jiān)視器:No Watchdog 電池備用開關(guān):No Backup 上電復(fù)位延遲（典型值）:10 s 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:UDFN-6 封裝:Reel |
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