參數(shù)資料
型號(hào)： TPA0222PWP
廠商： Texas Instruments, Inc.
元件分類： 音頻放大器
英文描述： STEREO 2-W AUDIO POWER AMPLIFIER WITH FOUR SELECTABLE GAIN SETTINGS AND MUX CONTROL
中文描述： 立體聲2 - W音頻功率放大器，具有四種可選增益設(shè)置和MUX控制
文件頁(yè)數(shù)： 18/33頁(yè)
文件大小： 522K
代理商： TPA0222PWP
TPA0222
STEREO 2-W AUDIO POWER AMPLIFIER
WITH FOUR SELECTABLE GAIN SETTINGS AND MUX CONTROL
SLOS285 – NOVEMBER 1999
18
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
THERMAL INFORMATION
The thermally enhanced PWP package is based on the 24-pin TSSOP, but includes a thermal pad (see Figure 41)
to provide an effective thermal contact between the IC and the PWB.
Traditionally, surface mount and power have been mutually exclusive terms. A variety of scaled-down TO-220-type
packages have leads formed as gull wings to make them applicable for surface-mount applications. These packages,
however, have only two shortcomings: they do not address the very low profile requirements (<2 mm) of many of
today’s advanced systems, and they do not offer a terminal-count high enough to accommodate increasing
integration. On the other hand, traditional low-power surface-mount packages require power-dissipation derating that
severely limits the usable range of many high-performance analog circuits.
The PowerPAD package (thermally enhanced TSSOP) combines fine-pitch surface-mount technology with thermal
performance comparable to much larger power packages.
The PowerPAD package is designed to optimize the heat transfer to the PWB. Because of the very small size and
limited mass of a TSSOP package, thermal enhancement is achieved by improving the thermal conduction paths that
remove heat from the component. The thermal pad is formed using a patented lead-frame design and manufacturing
technique to provide a direct connection to the heat-generating IC. When this pad is soldered or otherwise thermally
coupled to an external heat dissipator, high power dissipation in the ultra-thin, fine-pitch, surface-mount package can
be reliably achieved.
DIE
Side View (a)
End View (b)
Bottom View (c)
DIE
Thermal
Pad
Figure 41. Views of Thermally Enhanced PWP Package
Figure 42 and Figure 43 are schematic diagrams of typical notebook computer application circuits.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TPA0222PWPG4 功能描述:音頻放大器 St 2W Aud Pwr Amp RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TPA0222PWPR 功能描述:音頻放大器 St 2W Aud Pwr Amp RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TPA0222PWPRG4 功能描述:音頻放大器 St 2W Aud Pwr Amp RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
TPA0223 制造商:TI 制造商全稱:Texas Instruments 功能描述:2-W MONO AUDIO POWER AMPLIFIER WITH HEADPHONE DRIVE
TPA0223DGQ 功能描述:音頻放大器 2W Mono Aud Pwr Amp RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
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