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80C186EB/80C188EB, 80L186EB/80L188EB
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
Storage Temperature àààààààààà
b
65
§
C to
a
150
§
C
Case Temp under Bias ààààààààà
b
65
§
C to
a
120
§
C
Supply Voltage
with Respect to V
SS
ààààààààààà
b
0.5V to
a
6.5V
Voltage on other Pins
with Respect to V
SS
àààààà
b
0.5V to V
CC
a
0.5V
NOTICE: This data sheet contains preliminary infor-
mation on new products in production. It is valid for
the devices indicated in the revision history. The
specifications are subject to change without notice.
*
WARNING: Stressing the device beyond the ‘‘Absolute
Maximum Ratings’’ may cause permanent damage.
These are stress ratings only. Operation beyond the
‘‘Operating Conditions’’ is not recommended and ex-
tended exposure beyond the ‘‘Operating Conditions’’
may affect device reliability.
Recommended Connections
Power and ground connections must be made to
multiple V
CC
and V
SS
pins. Every 80C186EB-based
circuit board should include separate power (V
CC
)
and ground (V
SS
) planes. Every V
CC
pin must be
connected to the power plane, and every V
SS
pin
must be connected to the ground plane. Pins identi-
fied as ‘‘NC’’ must not be connected in the system.
Liberal decoupling capacitance should be placed
near the processor. The processor can cause tran-
sient power surges when its output buffers tran-
sition, particularly when connected to large capaci-
tive loads.
Low inductance capacitors and interconnects are
recommended for best high frequency electrical per-
formance. Inductance is reduced by placing the de-
coupling capacitors as close as possible to the proc-
essor V
CC
and V
SS
package pins.
Always connect any unused input to an appropriate
signal level. In particular, unused interrupt inputs
(INT0:4) should be connected to V
CC
through a pull-
up resistor (in the range of 50 K
X
).
Leave any un-
used output pin or any NC pin unconnected.
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