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參數(shù)資料
| 型號： | THS4031DGN |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | 100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS |
| 中文描述： | 100 MHz的低噪聲高速放大器 |
| 文件頁數(shù)： | 30/38頁 |
| 文件大小： | 674K |
| 代理商： | THS4031DGN |
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THS4031, THS4032
100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS
SLOS224C – JULY 1999 – REVISED APRIL 2000
30
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
general PowerPAD
design considerations (continued)
The actual thermal performance achieved with the THS403xDGN in its PowerPAD
package depends on the
application. In the example above, if the size of the internal ground plane is approximately 3 inches
×
3 inches,
then the expected thermal coefficient,
θ
JA
,
is
about 58.4 C/W. For comparison, the non-PowerPAD
version
of the THS403x IC (SOIC) is shown. For a given
θ
JA
, the maximum power dissipation is shown in Figure 56 and
is calculated by the following formula:
PD
TMAX–TA
JA
Where:
P
D
T
MAX
= Absolute maximum junction temperature (150
°
C)
T
A
= Free-ambient air temperature (
°
C)
θ
JA
=
θ
JC
+
θ
CA
θ
JC
= Thermal coefficient from junction to case
θ
CA
= Thermal coefficient from case to ambient air (
°
C/W)
= Maximum power dissipation of THS403x IC (watts)
DGN Package
θ
JA = 58.4
°
C/W
2 oz. Trace And Copper Pad
With Solder
DGN Package
θ
JA = 158
°
C/W
2 oz. Trace And
Copper Pad
Without Solder
High-K Test PCB
θ
JA = 98
°
C/W
TJ = 150
°
C
SOIC Package
Low-K Test PCB
θ
JA = 167
°
C/W
2
1.5
1
0
–40
–20
0
20
40
M
2.5
3
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
3.5
60
80
100
0.5
TA – Free-Air Temperature –
°
C
NOTE A: Results are with no air flow and PCB size = 3”
×
3”
Figure 56. Maximum Power Dissipation vs Free-Air Temperature
More complete details of the PowerPAD
installation process and thermal management techniques can be
found in the Texas Instruments technical brief, PowerPAD
Thermally Enhanced Package.This document can
be found at the TI web site (www.ti.com) by searching on the key word PowerPAD
. The document can also
be ordered through your local TI sales office. Refer to literature number SLMA002 when ordering.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| THS4031EVM | 100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS |
| THS4031FK | 100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS |
| THS4031MFK | 100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS |
| THS4032D | 100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS |
| THS4032DGN | 100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| THS4031-EP | 制造商:TI 制造商全稱:Texas Instruments 功能描述:100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS |
| THS4031EVM | 功能描述:放大器 IC 開發(fā)工具 THS4031 Hi-Spd Amp Eval Mod RoHS:否 制造商:International Rectifier 產(chǎn)品:Demonstration Boards 類型:Power Amplifiers 工具用于評估:IR4302 工作電源電壓:13 V to 23 V |
| THS4031FK | 制造商:TI 制造商全稱:Texas Instruments 功能描述:100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS |
| THS4031ID | 功能描述:高速運(yùn)算放大器 100MHz Low Noise RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
| THS4031IDG4 | 功能描述:高速運(yùn)算放大器 100-MHz Low Noise Volt-Feedback Amp RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補(bǔ)償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube |
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