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THS4031, THS4032
100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS
SLOS224C – JULY 1999 – REVISED APRIL 2000
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
functional block diagram
OUT
8
6
1
IN–
IN+
2
3
Null
–
+
1OUT
1IN–
1IN+
VCC
2OUT
2IN–
2IN+
–VCC
8
6
1
2
3
5
7
4
–
+
–
+
Figure 1. THS4031 – Single Channel
Figure 2. THS4032 – Dual Channel
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage, V
CC+
to V
CC–
Input voltage, V
I
Output current, I
O
Differential input voltage, V
IO
Continuous total power dissipation
Operating free-air temperature, T
A
:
33 V
±
V
CC
150 mA
±
4 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
C-suffix
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I-suffix
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
M-suffix
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum junction temperature, T
J
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, T
stg
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds, JG package
Case temperature for 60 seconds, FK package
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
See Dissipation Rating Table
0
°
C to 70
°
C
–40
°
C to 85
°
C
–55
°
C to 125
°
C
150
°
C
–65
°
C to 150
°
C
300
°
C
300
°
C
260
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
PACKAGE
θ
JA
(
°
C/W)
167
θ
JC
(
°
C/W)
TA = 25
°
C
POWER RATING
D
38.3
740 mW
DGN§
58.4
4.7
2.14 W
JG
119
28
1050 mW
FK
87.7
20
1375 mW
This data was taken using the JEDEC standard Low-K test PCB. For the JEDEC Proposed
High-K test PCB, the
θ
JA is 95
°
C/W with a power rating at TA = 25
°
C of 1.32 W.
§This data was taken using 2 oz. trace and copper pad that is soldered directly to a 3-in.
×
3-in.
PC. For further information, refer to Application Informationsection of this data sheet.