參數(shù)資料
型號： THS4031DGN
廠商： Texas Instruments, Inc.
英文描述： 100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS
中文描述： 100 MHz的低噪聲高速放大器
文件頁數(shù)： 29/38頁
文件大?。?/td> 674K
代理商： THS4031DGN
THS4031, THS4032
100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS
SLOS224C – JULY 1999 – REVISED APRIL 2000
29
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
general PowerPAD
design considerations (continued)
DIE
Side View (a)
End View (b)
Bottom View (c)
DIE
Thermal
Pad
NOTE B: The thermal pad is electrically isolated from all terminals in the package.
Figure 54. Views of Thermally Enhanced DGN Package
Although there are many ways to properly heatsink this device, the following steps illustrate the recommended
approach.
Thermal pad area (68 mils x 70 mils) with 5 vias
(Via diameter = 13 mils)
Figure 55. PowerPAD
PCB Etch and Via Pattern
1.
Prepare the PCB with a top-side etch pattern as shown in Figure 55. There should be etch for the leads as
well as etch for the thermal pad.
2.
Place five holes in the area of the thermal pad. These holes should be 13 mils in diameter. They are kept
small so that solder wicking through the holes is not a problem during reflow.
3.
Additional vias may be placed anywhere along the thermal plane outside of the thermal pad area. This helps
dissipate the heat generated by the THS403xDGN IC. These additional vias may be larger than the 13-mil
diameter vias directly under the thermal pad. They can be larger because they are not in the thermal pad
area to be soldered so that wicking is not a problem.
4.
Connect all holes to the internal ground plane.
5.
When connecting these holes to the ground plane, do
notuse the typical web or spoke via connection
methodology. Web connections have a high thermal-resistance connection that is useful for slowing the
heat transfer during soldering operations. This makes the soldering of vias that have plane connections
easier. In this application, however, low thermal resistance is desired for the most efficient heat transfer.
Therefore, the holes under the THS403xDGN package should connect to the internal ground plane with a
complete connection around the entire circumference of the plated-through hole.
6.
The top-side solder mask should leave the terminals of the package and the thermal pad area with its five
holes exposed. The bottom-side solder mask should cover the five holes of the thermal pad area, which
prevents solder from being pulled away from the thermal pad area during the reflow process.
7.
Apply solder paste to the exposed thermal pad area and to all the IC terminals.
8.
With these preparatory steps in place, the THS403xDGN IC is simply placed in position and run through
the solder reflow operation as any standard surface-mount component. This results in a part that is properly
installed.
相關(guān)PDF資料
PDF描述
THS4031EVM 100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS
THS4031FK 100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS
THS4031MFK 100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS
THS4032D 100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS
THS4032DGN 100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
THS4031-EP 制造商:TI 制造商全稱:Texas Instruments 功能描述:100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS
THS4031EVM 功能描述:放大器 IC 開發(fā)工具 THS4031 Hi-Spd Amp Eval Mod RoHS:否 制造商:International Rectifier 產(chǎn)品:Demonstration Boards 類型:Power Amplifiers 工具用于評估:IR4302 工作電源電壓:13 V to 23 V
THS4031FK 制造商:TI 制造商全稱:Texas Instruments 功能描述:100-MHz LOW-NOISE HIGH-SPEED AMPLIFIERS
THS4031ID 功能描述:高速運算放大器 100MHz Low Noise RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
THS4031IDG4 功能描述:高速運算放大器 100-MHz Low Noise Volt-Feedback Amp RoHS:否 制造商:Texas Instruments 通道數(shù)量:1 電壓增益 dB:116 dB 輸入補償電壓:0.5 mV 轉(zhuǎn)換速度:55 V/us 工作電源電壓:36 V 電源電流:7.5 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-8 封裝:Tube
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