參數(shù)資料
型號(hào)： TFP513PAPG4
廠商： TEXAS INSTRUMENTS INC
元件分類： 消費(fèi)家電
英文描述： SPECIALTY CONSUMER CIRCUIT, PQFP64
封裝： 10 X 10 MM, 1.00 MM HEIGHT, 0.50 MM PITCH, HTQFP-64
文件頁(yè)數(shù)： 20/32頁(yè)
文件大小： 1206K
代理商： TFP513PAPG4
TFP513
TI PanelBus DIGITAL TRANSMITTER
SLLS611 AUGUST 2004
27
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
MECHANICAL DATA
PAP (S-PQFP-G64)
PowerPAD
PLASTIC QUAD FLATPACK
Thermal Pad
(See Note D)
0,13 NOM
0,25
0,45
0,75
Seating Plane
4147702/A 01/98
Gage Plane
0,17
0,27
33
16
48
1
7,50 TYP
49
64
SQ
9,80
1,05
0,95
11,80
12,20
1,20 MAX
10,20
SQ
17
32
0,08
0,50
M
0,08
0
°7°
0,15
0,05
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MS-026
PowerPAD is a trademark of Texas Instruments.
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