參數(shù)資料
型號： TEA5764UK
廠商： NXP SEMICONDUCTORS
元件分類： 接收器
英文描述： FM radio + RDS
中文描述： FM, AUDIO SINGLE CHIP RECEIVER, PBGA34
封裝： 4 X 4 MM, WLB-34
文件頁數(shù)： 58/64頁
文件大?。?/td> 287K
代理商： TEA5764UK
TEA5764HN_2
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 9 August 2005
58 of 64
Philips Semiconductors
TEA5764HN
FM radio + RDS
18. Soldering
18.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
18.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215
°
C to 270
°
C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
below 225
°
C (SnPb process) or below 245
°
C (Pb-free process)
–
for all BGA, HTSSON..T and SSOP..T packages
–
for packages with a thickness
≥
2.5 mm
–
for packages with a thickness < 2.5 mm and a volume
≥
350 mm
3
so called
thick/large packages.
below 240
°
C (SnPb process) or below 260
°
C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
18.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
–
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
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TEA5764UK/N2,027 功能描述:調(diào)諧器 FM RADIO WITH RDS RoHS:否 制造商:NXP Semiconductors 功能: 噪聲系數(shù): 工作電源電壓: 最小工作溫度: 最大工作溫度:
TEA5764UK-G 功能描述:調(diào)諧器 FM RADIO WITH RDS RoHS:否 制造商:NXP Semiconductors 功能: 噪聲系數(shù): 工作電源電壓: 最小工作溫度: 最大工作溫度:
TEA5766UK/N1,023 功能描述:調(diào)節(jié)器/解調(diào)器 FM RADIO + RDS RoHS:否 制造商:Texas Instruments 封裝 / 箱體:PVQFN-N24 封裝:Reel
TEA5766UK/N1,118 功能描述:調(diào)節(jié)器/解調(diào)器 FM RADIO + RDS RoHS:否 制造商:Texas Instruments 封裝 / 箱體:PVQFN-N24 封裝:Reel
TEA5766UK/N1/S21,0 功能描述:調(diào)諧器 FM RADIO + RDS RoHS:否 制造商:NXP Semiconductors 功能: 噪聲系數(shù): 工作電源電壓: 最小工作溫度: 最大工作溫度:
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