參數(shù)資料
型號(hào)： TDA6500TT
廠商： NXP SEMICONDUCTORS
元件分類： 調(diào)諧器
英文描述： 5 V mixer/oscillator and synthesizer for PAL and NTSC standards
中文描述： 3-BAND, VIDEO TUNER, PDSO32
封裝： 6.10 MM, 0.65 MM PITCH, PLASTIC, MO-153, SOT487-1, TSSOP-32
文件頁(yè)數(shù)： 33/37頁(yè)
文件大小： 223K
代理商： TDA6500TT
9397 750 15057
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 14 June 2005
33 of 37
Philips Semiconductors
TDA6500; TDA6501
5 V mixer/oscillator and synthesizer for PAL and NTSC standards
–
smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
°
angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250
°
C
or 265
°
C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
15.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300
°
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270
°
C and 320
°
C.
15.5 Package related soldering information
[1]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note(AN01026);
order a copy from your Philips Semiconductors sales office.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
Table 33:
Package
[1]
Suitability of surface mount IC packages for wave and reflow soldering methods
Soldering method
Wave
BGA, HTSSON..T
[3]
, LBGA, LFBGA, SQFP,
SSOP..T
[3]
, TFBGA, VFBGA, XSON
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
[5]
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L
[8]
, PMFP
[9]
, WQCCN..L
[8]
Reflow
[2]
suitable
not suitable
not suitable
[4]
suitable
suitable
not recommended
[5] [6]
not recommended
[7]
not suitable
suitable
suitable
suitable
not suitable
相關(guān)PDF資料
PDF描述
TDA8391 One-chip PAL decoder and RGB matrix
TDA8451A P2CCD DELAY LINE AND MATRIX
TDA8452A P2CCD FILTER COMBINATION FOR COLOUR DECODERS
TDA8453A P2CCD FILTER COMBINATION FOR CVBS AND S-VHS
TDA9910 12-bit, up to 80 Msample/s, Analog-to-Digital Converter (ADC) direct/ultra high IF sampling
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
TDA6500TT/C4,118 功能描述:IC MIXER/OSC SYNTH 32TSSOP RoHS:是 類別:集成電路 (IC) >> 線性 - 視頻處理 系列:- 產(chǎn)品變化通告:Product Discontinuation 07/Mar/2011 標(biāo)準(zhǔn)包裝:3,000 系列:OMNITUNE™ 類型:調(diào)諧器 應(yīng)用:移動(dòng)電話，手機(jī)，視頻顯示器 安裝類型:表面貼裝 封裝/外殼:65-WFBGA 供應(yīng)商設(shè)備封裝:PG-WFSGA-65 包裝:帶卷 (TR) 其它名稱:SP000365064
TDA6501 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:5 V mixer/oscillator and synthesizer for PAL and NTSC standards
TDA6501TT 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:5 V mixer/oscillator and synthesizer for PAL and NTSC standards
TDA6502 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:5 V mixers/oscillators and synthesizers for cable TV and VCR 2-band tuners
TDA6502A 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:5 V mixers/oscillators and synthesizers for cable TV and VCR 2-band tuners
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*