參數(shù)資料
型號: TC1307
廠商: Microchip Technology Inc.
英文描述: Four-Channel CMOS LDO with Select Mode, Shutdown and Independent Reset
中文描述: 四通道CMOS低壓降穩(wěn)壓器的選擇模式,關(guān)機(jī)和獨立復(fù)位
文件頁數(shù): 19/28頁
文件大小: 553K
代理商: TC1307
2002 Microchip Technology Inc.
DS21702A-page 19
TC1307
5.6.2
OVER TEMPERATURE PROTECTION
If the internal power dissipation within the TC1307 is
excessive due to a faulted load or higher than specified
line voltage, an internal temperature sensing element
will prevent the junction temperature from exceeding
approximately 150°C. If the junction temperature does
exceed approximately 150°C, all LDO outputs will be
disabled until the junction temperature cools to approx-
imately 140°C, at which point the device will resume
normal operation. The RESET output will continue to
operate normally in the event of a thermal shutdown.
5.7
Recommended Physical Layout
Figure 5-2 represents a typical layout using the
TC1307 16-pin QSOP package. C
1
, C
2
, C
3
and C
4
are
1 μF X5R 0603 ceramic output capacitors and C
IN
is a
2.2 μF X5R 0805 ceramic capacitor. No other compo-
nents are required for this quad output LDO with micro-
controller reset function. Utilizing the highly integrated
TC1307, the total board area required is less than
0.300 square inches.
For CMOS LDOs, the GND or quiescent current is
small when compared to the maximum output current
capability. The GND pins connected to the TC1307 do
not carry high current and it is not necessary for them
to be wide. It is more important for the GND pins to be
connected to a quiet circuit ground. Noise on the GND
pins may result in noise at the output of the LDO. In
Figure 5-2, a ground plane is used to connect the
TC1307 Pins to the GND plane that has the V
capacitor return tied to it. For applications that have rip-
ple voltage on the input, the C
IN
capacitor return can be
separated from the ground plane by running a trace
from the capacitor to the ground plane. This impedance
will help to reduce the noise on the output of the LDO.
The output voltage regulation uses the GND pins of the
TC1307 as the return path for the internal bandgap ref-
erence. Any voltage drops between the load and the
respective V
OUT
pin and GND pin will show up as regu-
lation losses. It is important to size the V
and GND
conductors for minimum voltage drops. The maximum
application load current will determine how large these
traces should be. As shown in Figure 5-2, a ground
plane can be used minimize the trace resistance from
the load to the TC1307 GND pin.
FIGURE 5-2:
TC1307 Typical Layout.
SHDN1
SHDN3
SHDN2
SHDN4
RESET
VOUT1
VOUT2
VOUT3
VOUT4
CIN
C1C2
C4C3
Pin 1
= GND Plane
= Top Metal Layer
Backplane Traces
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