參數(shù)資料
型號(hào)： SMJ320C31KGDM40B
廠商： TEXAS INSTRUMENTS INC
元件分類： 數(shù)字信號(hào)處理
英文描述： 32-BIT, 40 MHz, OTHER DSP, UUC132
封裝： DIE
文件頁(yè)數(shù)： 49/59頁(yè)
文件大?。?/td> 1236K
代理商： SMJ320C31KGDM40B
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
5962-9205803MXA
ACTIVE
CPGA
GFA
141
1
TBD
Call TI
N / A for Pkg Type
5962-9205803MXC
ACTIVE
CPGA
GFA
141
1
TBD
Call TI
N / A for Pkg Type
5962-9205803MYA
ACTIVE
CFP
HFG
132
1
TBD
Call TI
N / A for Pkg Type
5962-9205804MXA
ACTIVE
CPGA
GFA
141
1
TBD
Call TI
N / A for Pkg Type
5962-9205804MXC
ACTIVE
CPGA
GFA
141
1
TBD
Call TI
N / A for Pkg Type
5962-9205804MYA
ACTIVE
CFP
HFG
132
1
TBD
Call TI
N / A for Pkg Type
5962-9205805QXA
ACTIVE
CPGA
GFA
141
1
TBD
Call TI
N / A for Pkg Type
5962-9205805QYA
ACTIVE
CFP
HFG
132
1
TBD
Call TI
N / A for Pkg Type
5962-9760601NXB
ACTIVE
BQFP
PQ
132
1
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-4-260C-72 HR
5962-9760601Q9A
OBSOLETE
XCEPT
KGD
0
TBD
Call TI
SM320C31GFAM50
ACTIVE
CPGA
GFA
141
1
TBD
Call TI
N / A for Pkg Type
SM320C31GFAS60
ACTIVE
CPGA
GFA
141
1
TBD
Call TI
N / A for Pkg Type
SM320C31HFGM40
ACTIVE
CFP
HFG
132
1
TBD
Call TI
N / A for Pkg Type
SM320C31HFGM50
ACTIVE
CFP
HFG
132
1
TBD
Call TI
N / A for Pkg Type
SM320C31HFGS60
ACTIVE
CFP
HFG
132
1
TBD
Call TI
N / A for Pkg Type
SMJ320C31GFAM40
ACTIVE
CPGA
GFA
141
1
TBD
Call TI
N / A for Pkg Type
SMJ320C31GFAM50
ACTIVE
CPGA
GFA
141
1
TBD
Call TI
N / A for Pkg Type
SMJ320C31GFAS60
ACTIVE
CPGA
GFA
141
1
TBD
Call TI
N / A for Pkg Type
SMJ320C31HFGM40
ACTIVE
CFP
HFG
132
1
TBD
Call TI
N / A for Pkg Type
SMJ320C31HFGM50
ACTIVE
CFP
HFG
132
1
TBD
Call TI
N / A for Pkg Type
SMJ320C31HFGS60
ACTIVE
CFP
HFG
132
1
TBD
Call TI
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
PACKAGE OPTION ADDENDUM
www.ti.com
23-Oct-2008
Addendum-Page 1
相關(guān)PDF資料
PDF描述
SMJ320C40KGDS50C 32-BIT, 50 MHz, OTHER DSP, UUC325
SMJ320C40TABM40/10 32-BIT, 40 MHz, OTHER DSP, UUC325
SM320C40TABS60/10 32-BIT, 60 MHz, OTHER DSP, UUC325
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SM320C6201BGLPW20 32-BIT, 200 MHz, OTHER DSP, CBGA429
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SMJ320C40 制造商:TI 制造商全稱:Texas Instruments 功能描述:DIGITAL SIGNAL PROCESSORS
SMJ320C40_08 制造商:TI 制造商全稱:Texas Instruments 功能描述:DIGITAL SIGNAL PROCESSORS
SMJ320C40GFM40 制造商:TI 制造商全稱:Texas Instruments 功能描述:DIGITAL SIGNAL PROCESSORS
SMJ320C40GFM50 制造商:Texas Instruments 功能描述:DSP Floating-Point 32-Bit 50MHz 25MIPS 325-Pin CPGA 制造商:Texas Instruments 功能描述:FLOATING-POINT DIGITAL SIGNAL PROCESSOR
SMJ320C40GFS60 制造商:TI 制造商全稱:Texas Instruments 功能描述:DIGITAL SIGNAL PROCESSORS
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