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參數(shù)資料
| 型號： | SMJ320C30KGDB |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 數(shù)字信號處理 |
| 英文描述： | FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE |
| 中文描述： | 浮點數(shù)字信號處理器已知好芯片 |
| 文件頁數(shù)： | 5/9頁 |
| 文件大小： | 116K |
| 代理商： | SMJ320C30KGDB |
SMJ320C30KGDB
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIE
SGUS019B – NOVEMBER 1995 – REVISED DECEMBER 1998
5
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251–1443
Table 1. ’320C30KGD Die Pad Information : rev 7.4 (0,72
μ
m)
DIE SIDE #1
’C30 DIE BOND PAD
LOCATIONS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
DIE/TAB BOND PAD
IDENTITY
PDVDD
PDVDD
DR0
FSR0
CLKR0
CLKX0
FSX0
DX0
TCLK0
TCLK1
PADTOG
IOD0
IOD1
IOD2
IODVDD
IODVDD
IOD3
IOD4
IOD5
IOD6
IOD7
IOD8
IOD9
IOD10
VDDL
VDDL
DVSS
VSSL
CVSS
IOD11
IOD12
IOD13
IOD14
IOD15
IOD16
IOD17
IOD18
IOD19
IOD20
IOD21
IOD22
IOD23
IOD24
IOD25
IOD26
IOD27
IOD28
IOD29
IOD30
IODVDD
IODVDD
X-COORDINATE OF
THE DIE BOND PAD
Y-COORDINATE OF
THE DIE BOND PAD
7165.35
7029.99
6895.42
6760.42
6625.42
6490.42
6355.42
6220.42
6085.42
5950.42
5815.42
5673.22
5538.22
5403.22
5268.22
5133.22
4998.22
4863.22
4728.22
4593.22
4458.22
4323.22
4188.22
4053.22
3918.22
3783.22
3644.08
3504.04
3369.04
3234.04
3099.04
2964.04
2829.04
2694.04
2559.04
2424.04
2289.04
2154.04
2019.04
1884.04
1749.04
1614.04
1479.04
1344.04
1209.04
1074.04
939.04
804.04
669.04
529.54
394.56
PITCH OF LEAD
– 614.16
135.36
134.57
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
142.20
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
139.14
140.04
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
135.00
139.50
134.98
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