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參數(shù)資料
| 型號： | SMJ320C30KGDB |
| 廠商： | Texas Instruments, Inc. |
| 元件分類： | 數(shù)字信號處理 |
| 英文描述： | FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE |
| 中文描述： | 浮點(diǎn)數(shù)字信號處理器已知好芯片 |
| 文件頁數(shù)： | 2/9頁 |
| 文件大小： | 116K |
| 代理商： | SMJ320C30KGDB |
SMJ320C30KGDB
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIE
SGUS019B – NOVEMBER 1995 – REVISED DECEMBER 1998
2
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251–1443
description
(Continued)
High-level language support is easily implemented through a register-based architecture, large address space,
powerful addressing modes, flexible instruction set, and well-supported floating-point arithmetic.
known good die (KGD) technology
KGD options are available for use in multichip modules and chip-on-board (COB) applications. The current
verification technology that supports KGD requirements for the SMJ320C30KGDB is a hot chuck probe
process. This process uses standard probed product that is tested in wafer form at speed and elevated
temperature to full data sheet specifications. Each individual die is then sawed, inspected, and packaged for
shipment.
electrical specifications
For electrical and timing specifications, see the SMJ320C30 Digital Signal Processordata sheet, literature
number SGUS014.
SMJ
320
C
30
KGD
M
40
PREFIX
SMJ =
MIL-PRF-38535
DEVICE FAMILY
320 =
DSP Family
TECHNOLOGY
C =
CMOS
DEVICE
30 =
Floating-Point DSP
SPEED RANGE
40 =
50 =
40 MHz
50 MHz
PACKAGE TYPE
KGD = Known Good Die
TEMPERATURE RANGE
M = – 55
°
C to125
°
C
L =
0
°
C to 70
°
C
B
DIE REVISION
’C30
B
=
Revision 7.4
Figure 1. SMJ320C30KGDB Device Nomenclature
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