參數(shù)資料
型號： SC16C550BIBS,128
廠商： NXP Semiconductors
文件頁數(shù)： 38/48頁
文件大小： 0K
描述： IC UART SOT617-1
標(biāo)準(zhǔn)包裝： 6,000
特點： 可編程
通道數(shù)： 1，UART
FIFO's： 16 字節(jié)
電源電壓： 2.5V，3.3V，5V
帶自動流量控制功能： 是
帶故障啟動位檢測功能： 是
帶調(diào)制解調(diào)器控制功能： 是
帶CMOS： 是
安裝類型： 表面貼裝
封裝/外殼： 32-VFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝： 32-HVQFN（5x5）
包裝： 帶卷 (TR)
其它名稱： 935279497128
SC16C550BIBS-F
SC16C550BIBS-F-ND
SC16C550B_5
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 1 October 2008
43 of 48
NXP Semiconductors
SC16C550B
5 V, 3.3 V and 2.5 V UART with 16-byte FIFOs
12.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 28) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 27 and 28
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 28.
Table 27.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 28.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SC16C550BIBS-F 功能描述:UART 接口集成電路 16CB 2.5V-5V 1CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C550BIBS-S 功能描述:UART 接口集成電路 16CB 2.5V-5V 1CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C550BIN40 制造商:NXP Semiconductors 功能描述:UART 16BYTE FIFO 16C550 DIP40
SC16C550BIN40,112 功能描述:UART 接口集成電路 16CB 2.5V-5V 1CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C550IA44 制造商:NXP Semiconductors 功能描述:UART 16BYTE FIFO 16C550 PLCC44
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