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| 型號(hào)： | S71GL064A08BAW0B2 |
| 廠商： | SPANSION LLC |
| 元件分類(lèi)： | 存儲(chǔ)器 |
| 英文描述： | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| 中文描述： | SPECIALTY MEMORY CIRCUIT, PBGA56 |
| 封裝： | 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 |
| 文件頁(yè)數(shù)： | 83/102頁(yè) |
| 文件大?。?/td> | 1606K |
| 代理商： | S71GL064A08BAW0B2 |
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March 31, 2005 S71GL032A_00_A0
S71GL032A Based MCPs
83
A d v a n c e I n f o r m a t i o n
Capacitance
Note:
Tested initially and after any design or process changes that may affect these parameters.
Thermal Resistance
Note:
Tested initially and after any design or process changes that may affect these parameters.
AC Test Loads and Waveforms
Parameter
Description
Test Condition
Max
Unit
C
IN
Input Capacitance
T
A
= 25°C, f = 1 MHz,
V
CC
= V
CC(typ.)
8
pF
C
OUT
Output Capacitance
8
Parameter
Description
Test Conditions
VFBGA
Unit
θ
JA
Thermal Resistance (Junction to Ambient) Test conditions follow standard test methods
and procedures for measuring thermal
impedance, per EIA / JESD51.
Thermal Resistance (Junction to Case)
55
°C/W
θ
JC
17
Figure 25. AC Test Loads and Waveforms
Parameters
3.0V V
CC
Unit
R1
22000
R2
22000
R
TH
11000
V
TH
1.50
V
V
CC
V
CC
OUTPUT
R2
30 pF
INCLUDING
J IG AND
S COPE
GND
90%
10%
90%
10%
OUTPUT
V
TH
Equivalent to:
THé VENINEQUIVALENT
ALL INPUT PULSES
R
T H
R1
Rise Time: 1 V/ns
Fall Time: 1 V/ns
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| S71GL064A80BAI0F0 | INDUCTOR,TOROID,HORIZONTAL, 22.0 uH,7.0 IDC,0.015 OHM, |
| S71GL064A80BAI0F2 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A80BAI0F3 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A80BAW0B3 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A80BAW0F3 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S71GL064A08BAW0B3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A08BAW0F0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A08BAW0F2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A08BAW0F3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A08BFI0B0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
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