參數(shù)資料
型號: S29GL064M90FDIR00
廠商: Spansion Inc.
英文描述: 3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
中文描述: 3.0伏只頁面模式閃存具有0.23微米工藝技術的MirrorBit
文件頁數(shù): 147/160頁
文件大?。?/td> 2142K
代理商: S29GL064M90FDIR00
April 30, 2004 S29GLxxxM_00A5
S29GLxxxM MirrorBit
TM
Flash Family
147
P r e l i m i n a r y
Physical Dimensions
TS048—48-Pin Standard/Reverse Thin Small Outline Package (TSOP)
-X-
X = A OR B
e/2
DETAIL B
c
L
0.25MM (0.0098") BSC
0
DETAIL A
R
GAGE LINE
PARALLEL TO
SEATING PLANE
b
b1
(c)
7
6
c1
WITH PLATING
BASE METAL
7
C A-B S
M
0.08MM (0.0031")
SECTION B-B
e
0.10 C
A2
PLANE
SEATING
C
A1
SEE DETAIL B
B
B
B
B
SEE DETAIL A
2
STANDARD PIN OUT (TOP VIEW)
2
N
N
1
4
2
A
-A-
-B-
5
9
E
5
D1
D
6
2
3
4
5
7
8
9
TS 048
MO-142 (B) EC
48
MIN
0.05
0.95
0.17
0.17
0.10
0.10
19.80
18.30
11.90
0.50
0
0.08
0.50 BASIC
0.60
3
MAX
1.20
0.15
1.05
0.27
0.16
0.21
20.20
5
0.20
18.50
12.10
0.70
0.23
0.20
0.22
1.00
18.40
12.00
20.00
NOM
Symbol
A
Jedec
Package
b1
b
c1
c
A2
A1
D
D1
L
0
R
N
e
E
1
NOTES:
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (MM).
(DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982)
PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).
NOT APPLICABLE.
TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS DEFINED AS THE PLANE OF
CONTACT THAT IS MADE WHEN THE PACKAGE LEADS ARE ALLOWED TO REST FREELY ON A FLAT
HORIZONTAL SURFACE.
DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTUSION IS
0.15MM (.0059") PER SIDE.
DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE DAMBAR PROTUSION SHALL BE
0.08 (0.0031") TOTAL IN EXCESS OF b DIMENSION AT MAX. MATERIAL CONDITION. MINIMUM SPACE
BETWEEN PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 (0.0028").
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10MM (.0039") AND
0.25MM (0.0098") FROM THE LEAD TIP.
LEAD COPLANARITY SHALL BE WITHIN 0.10MM (0.004") AS MEASURED FROM THE SEATING PLANE.
DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
3325 \ 16-038.10a
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