參數(shù)資料
型號(hào)： S25FL004AOLNFI000
廠商： Spansion Inc.
英文描述： 4-Megabit CMOS 3.0 Volt Flash Memory with 50 Mhz SPI Bus Interface
中文描述： 4兆位閃存的CMOS 3.0伏，50赫茲SPI總線接口內(nèi)存
文件頁(yè)數(shù)： 37/39頁(yè)
文件大小： 945K
代理商： S25FL004AOLNFI000
March 28, 2005 S25FL004A_00_A1
S25FL Family (Serial Peripheral Interface) S25FL004A
35
A d v a n c e I n f o r m a t i o n
Physical Dimensions
S08 wide—8-pin Plastic Small Outline 208 mils Body Width Package
3432 \ 16-038.03 \ 10.28.04
NOTES:
1.
2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M - 1994.
3.
DIMENSION D DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 mm
PER END. DIMENSION E1 DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 mm PER SIDE. D AND E1
DIMENSIONS ARE DETERMINED AT DATUM H.
4. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE
BOTTOM. DIMENSIONS D AND E1 ARE DETERMINED AT THE
OUTMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF
MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD
FLASH. BUT INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
5. DATUMS A AND B TO BE DETERMINED AT DATUM H.
6. "N" IS THE MAXIMUM NUMBER OF TERMINAL POSITIONS FOR
THE SPECIFIED PACKAGE LENGTH.
7. THE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD
BETWEEN 0.10 TO 0.25 mm FROM THE LEAD TIP.
8. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.10 mm TOTAL
IN EXCESS OF THE "b" DIMENSION AT MAXIMUM MATERIAL
CONDITION. THE DAMBAR CANNOT BE LOCATED ON THE
LOWER RADIUS OF THE LEAD FOOT.
9. THIS CHAMFER FEATURE IS OPTIONAL. IF IT IS NOT PRESENT,
THEN A PIN 1 IDENTIFIER MUST BE LOCATED WITHIN THE INDEX
AREA INDICATED.
10. LEAD COPLANARITY SHALL BE WITHIN 0.10 mm AS MEASURED
FROM THE SEATING PLANE.
ALL DIMENSIONS ARE IN BOTH INCHES AND MILLMETERS.
.
PACKAGE
SOC 008 (inches)
SOC 008 (mm)
JEDEC
SYMBOL
MIN
MAX
MIN
MAX
A
0.069
0.085
1.753
2.159
A1
0.002
0.0098
0.051
0.249
A2
0.067
0.075
1.70
1.91
b
0.014
0.019
0.356
0.483
b1
0.013
0.018
0.330
0.457
c
0.0075
0.0095
0.191
0.241
c1
0.006
0.008
0.152
0.203
D 0.208 BSC 5.283 BSC
E 0.315 BSC 8.001 BSC
E1 0.208 BSC 5.283 BSC
e .050 BSC 1.27 BSC
L
0.020
0.030
0.508
0.762
L1 .055 REF 1.40 REF
L2 .010 BSC 0.25 BSC
N
θ
θ1
θ2
8 8
0
8
0
8
5
15
5
15
0 0
9
C
A
A1
A2
b
e
5
B
D
E
E/2
5
E1/2
4
3
E1
3
SEATING PLANE
4
D
A
0.10
0.10
A-B
0.20
C
A-B
C
C
C
M
D
0.25
0.33
C
H
SEE
DETAIL B
b1
c1
7
(b)
c
WITH
PLATING
BASE
METAL
SECTION A-A
2
0.07 R MIN.
1
L1
C
L2
A
A
L
GAUGE
PLANE
SEATING
PLANE
H
DETAIL B
q
q
q
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