
8201layoutguide(V1.00)
2000-11-08
REALTEK
Chip design & System design
2
mounted at 90° to each others. High Current devices should be placed near to the
Power source to reduce the trace length. Traces with high current will induce more
EMI.
!
Termination Resistors :
As above in Block A and B, pull high resistors and cap of A need to be close to
RTL8201 and the two receiving termination resistors (50
) may be placed close to
Mag. For better impedence matching, these resistor/cap pairs should be chosen
carefully.
!
The traces between RTL8201 and Mag. (L2) are too, as short as possible. For
practical implementation convenience, this could be sacrificed. But it is important
to keep the Tx
±
, Rx
±
signal traces to be symmetry, and L2 is still needed to keep in
a reasonable range, about 10~12cm Maximum.
!
The signal trace length difference between Tx+ and Tx- (Rx+ and Rx-) should be
kept within 2 cm.
3. Trace Routing
Good routing of traces can reduce the propagation delay, cross-talk, high-freq. noise and
improve the signal quality that receiver received and reduce the loss from transmit signals.
!
Avoid right angle signal trace :
A
B
bad !
A
B
good !
!
Avoid digital signals (such as MII signals or CLOCKs) to interference with
Tx
±
25M
Cryst
out
8
2
0
1
bad !
Tx
±
8
2
0
1
digital signals
trace through the back
OK !
trace through the back
Tx
±
25M
Crys
out
8
2
0
1
GND
with GND
OK !
X1,X2
analog signals (Tx
±
, Rx
±
, RTset trace) and Power trace! And if it is necessary to