
8201layoutguide(V1.00)
2000-11-08
REALTEK
Chip design & System design
1
RTL8201 PCB Layout Guide
1. Introduction
Goal : (1) Make a Noise-free, power-stable, environment that suitable for RTL8201.
(2) Reduce the possibility of EMI, EMC and their influence to the chip.
(3) Simplify the task of routing signal trace, so as to make a better circuit for
RTL8201.
2. Placement
Ideally placement: as fellow
!
Block A should place as close to RTL8201 as possible. Block B may be placed
close to Mag. (Since when Tx, RTL8201 will sink current from Block A. When Rx,
RTL8201 will take differential volt signal from Block B.
!
The distance between RJ-45 to Mag. (L1) should be as short as possible.
!
RTset of RTL8201 pin 28 should placed as close to RTL8201 as possible and if
possible, it should be placed away from TX+/-,RX+/-, and clock signals
.
!
Crystal should not be placed near I/O ports and board edges and other high-freq.
devices or traces (such as Tx , Rx and Power signals) or magnetic field device (such
as magnetic).
!
The outer shield of Crystal need well grounding to avoid EMC/EMI to induce extra
noise, the retaining straps of the Crystal need well grounding, so as the case of
Crystal.
!
The magnetic device or devices with magnetic fields should be separated and
MII
Interface
Mag
RJ-45
L1
L2
A
B
OSC
RTL
8201
Tx
±
Rx
±
MAC