參數(shù)資料
型號: RD28F1602C3T90
廠商: INTEL CORP
元件分類: 存儲器
英文描述: 3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA66
封裝: 8 X 10 MM, 1.20 MM HEIGHT, SCSP-66
文件頁數(shù): 4/70頁
文件大小: 1223K
代理商: RD28F1602C3T90
Contents
4
Datasheet
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
DCCharacteristics..............................................................................................................26
FlashACCharacteristics....................................................................................................29
FlashACCharacteristics—WriteOperations......................................................................31
FlashEraseandProgramTimings(1).................................................................................31
FlashResetOperations......................................................................................................34
SRAMACCharacteristics—ReadOperations....................................................................35
SRAMACCharacteristics—WriteOperations....................................................................37
SRAMDataRetentionCharacteristics—ExtendedTemperature.......................................39
6.0
MigrationGuideInformation
......................................................................................................40
7.0
SystemDesignConsiderations
..................................................................................................41
7.1
Background.........................................................................................................................41
7.1.1
Flash+SRAMFootprintIntegration ......................................................................41
7.1.2
Advanced+BootBlockFlashMemoryFeatures ...................................................41
7.2
FlashControlConsiderations .............................................................................................41
7.2.1
F-RP#ConnectedtoSystemReset.......................................................................42
7.2.2
F-VCC,F-VPPandF-RP#Transition....................................................................42
7.3
NoiseReduction .................................................................................................................43
7.4
SimultaneousOperation.....................................................................................................44
7.4.1
SRAMOperationduringFlash“Busy” ...................................................................45
7.4.2
SimultaneousBusOperations ...............................................................................45
7.5
PrintedCircuitBoardNotes................................................................................................45
7.6
SystemDesignNotesSummary.........................................................................................45
AppendixAProgram/EraseFlowcharts
.............................................................................................46
AppendixBCFIQueryStructure
........................................................................................................52
AppendixCWord-WideMemoryMapDiagrams
...............................................................................59
AppendixDDeviceIDTable
................................................................................................................62
AppendixEProtectionRegisterAddressing
.....................................................................................63
AppendixFMechanicalandShippingMediaDetails
........................................................................64
AppendixGAdditionalInformation
....................................................................................................68
AppendixHOrderingInformation
.......................................................................................................69
相關PDF資料
PDF描述
RD28F3208C3T90 3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
RD28F1602C3BD70 3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
RD28F1604C3BD70 3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
RD38F1010C0ZTL0 3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
RD38F1020C0ZBL0 3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
相關代理商/技術參數(shù)
參數(shù)描述
RD28F1602C3TD70 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
RD28F1604C3B110 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
RD28F1604C3B90 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
RD28F1604C3BD70 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
RD28F1604C3BD70A 功能描述:IC FLASH 16MBIT 70NS 66EBGA RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:96 系列:- 格式 - 存儲器:閃存 存儲器類型:FLASH 存儲容量:16M(2M x 8,1M x 16) 速度:70ns 接口:并聯(lián) 電源電壓:2.65 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-TFSOP(0.724",18.40mm 寬) 供應商設備封裝:48-TSOP 包裝:托盤