參數(shù)資料
型號(hào): PIC10F222-E/OT
廠商: Microchip Technology
文件頁(yè)數(shù): 76/86頁(yè)
文件大?。?/td> 0K
描述: IC PIC MCU FLASH 512X12 SOT-23-6
標(biāo)準(zhǔn)包裝: 3,000
系列: PIC® 10F
核心處理器: PIC
芯體尺寸: 8-位
速度: 8MHz
外圍設(shè)備: POR,WDT
輸入/輸出數(shù): 4
程序存儲(chǔ)器容量: 768B(512 x 12)
程序存儲(chǔ)器類型: 閃存
RAM 容量: 23 x 8
電壓 - 電源 (Vcc/Vdd): 2 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 2x8b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 125°C
封裝/外殼: SOT-23-6
包裝: 散裝
PIC10F220/222
DS41270E-page 76
2007 Microchip Technology Inc.
8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
8
Pitch
e
.100 BSC
Top to Seating Plane
A
.210
Molded Package Thickness
A2
.115
.130
.195
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.290
.310
.325
Molded Package Width
E1
.240
.250
.280
Overall Length
D
.348
.365
.400
Tip to Seating Plane
L
.115
.130
.150
Lead Thickness
c
.008
.010
.015
Upper Lead Width
b1
.040
.060
.070
Lower Lead Width
b
.014
.018
.022
Overall Row Spacing §
eB
.430
N
E1
NOTE 1
D
12
3
A
A1
A2
L
b1
b
e
E
eB
c
Microchip Technology Drawing C04-018B
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