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PDM41024
2
4/09/98 - Rev. 3.3
Pin Conguration
SOJ
A11
A9
A8
A13
WE
CE2
A15
Vcc
NC
A16
A14
A12
A7
A6
A5
A4
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A10
CE1
I/O7
I/O6
I/O5
I/O4
I/O3
Vss
I/O2
I/O1
I/O0
A0
A1
A2
A3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
1
2
3
4
5
6
7
8
9
10
11
12
15
16
17
18
19
20
21
22
23
24
NC
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
Vss
Vcc
A15
CE2
WE
A13
A8
A9
A11
OE
A10
CE1
I/O7
I/O6
I/O5
I/O4
I/O3
13
14
25
26
27
28
29
30
31
32
Truth Table(1)
NOTE: 1. H = VIH, L = VIL, X = DON’T CARE
OE
WE
CE1
CE2
I/O
MODE
X
H
X
Hi-Z
Standby
X
L
Hi-Z
Standby
LH
L
H
DOUT
Read
XL
L
H
DIN
Write
H
L
H
Hi-Z
Output Disable
Pin Description
Name
Description
A16-A0
Address Inputs
I/O7-I/O0
Data Inputs/Outputs
OE
Output Enable Input
WE
Write Enable Input
CE1, CE2
Chip Enable Inputs
NC
No Connect
VCC
Power (+5V)
VSS
Ground
TSOP (I)
Absolute Maximum Ratings (1)
NOTE: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation of
the device at these or any other conditions above those indicated in the operational
sections of this specication is not implied. Exposure to absolute maximum rating con-
ditions for extended periods may affect reliability.
2. Appropriate thermal calculations should be performed in all cases and specically for
those where the chosen package has a large thermal resistance (e.g., TSOP). The cal-
culation should be of the form: Tj = Ta + P * θja where Ta is the ambient temperature, P
is average operating power and
θ
ja the thermal resistance of the package. For this
product, use the following
θ
ja values:
SOJ: 72o C/W
TSOP: 95o C/W
Symbol
Rating
Com’l.
Ind.
Unit
VTERM
Terminal Voltage with Respect to VSS
–0.5 to +7.0
V
TBIAS
Temperature Under Bias
–55 to +125
–65 to +135
°C
TSTG
Storage Temperature
–55 to +125
–65 to +150
°C
PT
Power Dissipation
1.0
W
IOUT
DC Output Current
50
mA
Tj
Maximum Junction Temperature (2)
125
145
°C