參數(shù)資料
型號(hào): PCF2113DU2
廠(chǎng)商: NXP Semiconductors N.V.
英文描述: LCD controllers/drivers
中文描述: LCD控制器/驅(qū)動(dòng)器
文件頁(yè)數(shù): 63/72頁(yè)
文件大?。?/td> 332K
代理商: PCF2113DU2
2001 Dec 19
63
Philips Semiconductors
Product specification
LCD controllers/drivers
PCF2113x
18 TRAY INFORMATION
Fig.35 Tray details.
handbook, full pagewidth
MGU206
D
C
A
x
y
F
E
B
For dimensions see Table 19.
Table 19
Tray dimensions
Table 20
Bump size
handbook, halfpage
MGU207
PC2113x
Fig.36 Tray alignment.
The orientation of the IC in a pocket is indicated by the position of the
IC type name on the die surface with respect to the chamfer on the
upper left corner of the tray. Refer to the bonding pad location
diagram for the orientating and position of the type name on the die
surface.
DIMENSION
DESCRIPTION
VALUE
A
B
C
D
E
F
x
y
pocket pitch x direction
pocket pitch y direction
pocket width x direction
pocket width y direction
tray width x direction
tray width y direction
pockets in x direction
pockets in y direction
6.35 mm
5.59 mm
3.82 mm
3.66 mm
50.8 mm
50.8 mm
7
8
PARAMETER
VALUE
UNIT
μ
m
μ
m
μ
m
μ
m
μ
m
μ
m
μ
m
μ
m
Type
Bump width
Bump length
Bump height
Height difference in one die
Convex deformation
Pad size, aluminium
Passivation opening CBB
Wafer thickness
galvanic pure Au
50
±
6
90
±
6
17.5
±
5
<2
<5
62
×
100
36
×
76
380
±
25
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