參數(shù)資料
型號(hào)： PCA9673D
廠商： NXP Semiconductors N.V.
元件分類： I2C/I2S
英文描述： Remote 16-bit I-O expander for Fm+ I2C-bus with interrupt and reset
封裝： PCA9673BQ<SOT815-1 (DHVQFN24)|<<http://www.nxp.com/packages/SOT815-1.html<1<Always Pb-free,;PCA9673BS<SOT616-1 (HVQFN24)|<<http://www.nxp.com/packages/SOT616-1.html<1&
文件頁(yè)數(shù)： 27/33頁(yè)
文件大?。?/td> 283K
代理商： PCA9673D
PCA9673
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 29 September 2011
27 of 33
NXP Semiconductors
PCA9673
Remote 16-bit I/O expander for Fm+ I
2
C-bus with interrupt and reset
15. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in
JESD625-A
or equivalent standards.
16. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
AN10365 “Surface mount reflow
soldering description”
.
16.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
16.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
16.3 Wave soldering
Key characteristics in wave soldering are:
相關(guān)PDF資料
PDF描述
PCA9674ABS Remote 8-bit I-O expander for Fm+ I2C-bus with interrupt
PCF85176T Universal LCD driver for low multiplex rates
PCF8574AT Remote 8-bit I-O expander for I2C-bus
PCF8574P Remote 8-bit I-O expander for I2C-bus
PCF8574T Remote 8-bit I-O expander for I2C-bus
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PCA9673D,112 功能描述:接口-I/O擴(kuò)展器 16BIT I2C FM+ QBGPIO RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9673D,118 功能描述:接口-I/O擴(kuò)展器 16BIT I2C FM+ QBGPIO RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9673DB 功能描述:接口-I/O擴(kuò)展器 16BIT I2C FM+ QBGPIO INT-RS PU RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9673DB,112 功能描述:接口-I/O擴(kuò)展器 16BIT I2C FM+ QBGPIO RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9673DB,118 功能描述:接口-I/O擴(kuò)展器 16BIT I2C FM+ QBGPIO RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*