參數(shù)資料
型號(hào)： PC33975AR2
廠商： 飛思卡爾半導(dǎo)體(中國(guó))有限公司
英文描述： Multiple Switch Detection Interface with Suppressed Wake-Up and 32mA Wetting Current
中文描述： 多交換檢測(cè)接口，具有抑制喚醒和32毫安濕電流
文件頁數(shù)： 5/32頁
文件大?。?/td> 641K
代理商： PC33975AR2
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
33975
MAXIMUM RATINGS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these limits may cause malfunction or permanent
damage to the device.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
V
DD
Supply Voltage
–
-0.3 to 7.0
V
DC
CS,
SI, SO, SCLK,
INT
, AMUX
–
-0.3 to 7.0
V
DC
WAKE
–
-0.3 to 40
V
DC
V
PWR
Supply Voltage
–
-0.3 to 50
V
DC
Switch Input Voltage Range
MC33975
PC339775A
–
-14 to 38
-14 to 40
V
DC
Frequency of SPI Operation (V
DD
= 5.0 V)
–
6.0
MHz
ESD Voltage
(1)
Human Body Model
(2)
Applies to all non-input terminals
Machine Model
Charge Device Model
Corner Terminals
Interior Terminals
V
ESD
±4000
±2500
±200
750
500
V
THERMAL RATINGS
Operating Temperature
Ambient
Junction
Case
T
A
T
J
T
C
-40 to 125
-40 to 150
-40 to 125
°
C
Storage Temperature
T
STG
-55 to 150
°
C
Power Dissipation
(3)
P
D
1.7
W
Thermal Resistance
Junction to Ambient
Between the Die and the Exposed Die Pad
(4)
R
θ
JA
R
θ
JC
71
1.2
°
C/W
Peak Package Reflow Temperature During Solder Mounting
(5)
T
SOLDER
245
°
C
Notes
1.
ESD testing is performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500
), the Machine Model (C
ZAP
= 200
pF, R
ZAP
= 0
), and the Charge Device Model.
All Programmable Switches (SP) and Switch-to-Ground (SG) input terminals when tested individually.
Maximum power dissipation at T
J
=150
°
C junction temperature with no heatsink used.
Thermal resistance between the die and the exposed die pad.
Terminal soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits
may cause malfunction or permanent damage to the device.
2.
3.
4.
5.
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