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Appendix A Electrical Characteristics
MC9S12XE-Family Reference Manual Rev. 1.07
Freescale Semiconductor
943
A.3.2
NVM Reliability Parameters
The reliability of the NVM blocks is guaranteed by stress test during qualification, constant process
monitors and burn-in to screen early life failures.
The data retention and program/erase cycling failure rates are specified at the operating conditions noted.
The program/erase cycle count on the sector is incremented every time a sector or mass erase event is
executed.
Table A-19. NVM Reliability Characteristics
Conditions are shown in
Table A-4
unless otherwise noted
Num
C
Rating
Symbol
Min
Typ
Max
Unit
Program Flash Arrays
1
C Data retention at an average junction temperature of T
Javg
=
85
°
C
1
after up to 10,000 program/erase cycles
1
T
does not exceed 85
°
C in a typical temperature profile over the lifetime of a consumer, industrial or automotive
application.
2
Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated
to 25
°
C using the Arrhenius equation. For additional information on how Freescale defines Typical Data Retention, please
refer to Engineering Bulletin EB618
3
Spec table quotes typical endurance evaluated at 25
°
C for this product family. For additional information on how Freescale
defines Typical Endurance, please refer to Engineering Bulletin EB619.
t
PNVMRET
20
100
2
—
Years
2
C Program Flash number of program/erase cycles
(-40
°
C
≤
tj
≤
150
°
C
)
n
PFLPE
10K
100K
3
—
Cycles
Data Flash Array
3
C Data retention at an average junction temperature of T
Javg
=
85
°
C
1
after up to 50,000 program/erase cycles
t
DNVMRET
5
100
2
—
Years
4
C Data retention at an average junction temperature of T
Javg
=
85
°
C
1
after less than 10,000 program/erase cycles
t
DNVMRET
10
100
2
—
Years
5
C Data retention at an average junction temperature of T
Javg
=
85
°
C
1
after less than 100 program/erase cycles
t
DNVMRET
20
100
2
—
Years
6
C Data Flash number of program/erase cycles (-40
°
C
≤
tj
≤
150
°
C
)
n
DFLPE
50K
500K
3
—
Cycles
Emulated EEPROM
7
C Data retention at an average junction temperature of T
Javg
=
85
°
C
1
after spec. program/erase cycles
t
EENVMRET
5
4
100
2
—
Years
8
C Data retention at an average junction temperature of T
Javg
=
85
°
C
1
after less than 20% spec.program/erase cycles.
(e.g. after <20,000 cycles / Spec 100,000 cycles)
t
EENVMRET
10
100
2
—
Years
9
C Data retention at an average junction temperature of T
Javg
=
85
°
C
1
after less than 0.2% spec. program/erase cycles
(e.g. after < 200 cycles / Spec 100,000 cycles)
t
EENVMRET
20
100
2
—
Years
10
C EEPROM number of program/erase cycles with a ratio of
FLASH-EE to RAM-EE = 8 (-40
°
C
≤
tj
≤
150
°
C
)
n
EEPE
100K
4
1M
5
—
Cycles
11
C EEPROM number of program/erase cycles with a ratio of
FLASH-EE to RAM-EE = 128 (-40
°
C
≤
tj
≤
150
°
C
)
n
EEPE
1.6M
4
16M
—
Cycles
12
C EEPROM number of program/erase cycles with a ratio of
FLASH-EE to RAM-EE = 8064
6
(-40
°
C
≤
tj
≤
150
°
C
)
n
EEPE
100M
4
1000M
—
Cycles