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參數(shù)資料
| 型號： | MSC7116 |
| 廠商： | 飛思卡爾半導體(中國)有限公司 |
| 英文描述： | Low-Cost 16-bit DSP with DDR Controller and 10/100 Mbps Ethernet MAC |
| 中文描述： | 低成本16位數(shù)字信號處理器與DDR控制器和10/100 Mbps以太網(wǎng)MAC |
| 文件頁數(shù)： | 41/56頁 |
| 文件大?。?/td> | 719K |
| 代理商： | MSC7116 |
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Hardware Design Considerations
MSC7116 10/100 Mbps Ethernet MAC Data Sheet, Rev. 11
Freescale Semiconductor
41
3
Hardware Design Considerations
This section described various areas to consider when incorporating the MSC7116 device into a system design.
3.1
An estimation of the chip-junction temperature
,
T
J
,
in
°
C can be obtained from the following:
Thermal Design Considerations
T
J
= T
A
+ (R
θ
JA
×
P
D
)
Eqn. 1
where
T
A
= ambient temperature near the package (
°
C)
R
θ
JA
= junction-to-ambient thermal resistance (
°
C/W)
P
D
= P
INT
+ P
I/O
= power dissipation in the package (W)
P
INT
= I
DD
×
V
DD
= internal power dissipation (W)
P
I/O
= power dissipated from device on output pins (W)
The power dissipation values for the MSC7116 are listed in
Table 4
. The ambient temperature for the device is the air
temperature in the immediate vicinity that would cool the device. The junction-to-ambient thermal resistances are JEDEC
standard values that provide a quick and easy estimation of thermal performance. There are two values in common usage: the
value determined on a single layer board and the value obtained on a board with two planes. The value that more closely
approximates a specific application depends on the power dissipated by other components on the printed circuit board (PCB).
The value obtained using a single layer board is appropriate for tightly packed PCB configurations. The value obtained using a
board with internal planes is more appropriate for boards with low power dissipation (less than 0.02 W/cm
2
with natural
convection) and well separated components. Based on an estimation of junction temperature using this technique, determine
whether a more detailed thermal analysis is required. Standard thermal management techniques can be used to maintain the
device thermal junction temperature below its maximum. If T
J
appears to be too high, either lower the ambient temperature or
the power dissipation of the chip.
You can verify the junction temperature by measuring the case temperature using a small diameter thermocouple (40 gauge is
recommended) or an infrared temperature sensor on a spot on the device case. Use the following equation to determine T
J
:
T
J
= T
T
+ (
Ψ
JT
×
P
D
)
Eqn. 2
where
T
T
= thermocouple (or infrared) temperature on top of the package (
°
C)
Ψ
JT
= thermal characterization parameter (
°
C/W)
P
D
= power dissipation in the package (W)
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