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| 型號(hào)： | MPC8379E-RDB |
| 廠商： | Freescale Semiconductor |
| 文件頁(yè)數(shù)： | 10/117頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | BOARD REFERENCE FOR MPC837 |
| 標(biāo)準(zhǔn)包裝： | 1 |
| 系列： | PowerQUICC II™ PRO |
| 類型： | MPU |
| 適用于相關(guān)產(chǎn)品： | MPC8379 |
| 所含物品： | 板 |
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MPC8379E PowerQUICC II Pro Processor Hardware Specifications, Rev. 8
Freescale Semiconductor
107
The thermal resistance is expressed as the sum of a junction to case thermal resistance and a
case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where:
RθJA = junction to ambient thermal resistance (°C/W)
RθJC = junction to case thermal resistance (°C/W)
RθCA = case to ambient thermal resistance (°C/W)
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case to ambient thermal resistance, RθCA. For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed circuit
board, or change the thermal dissipation on the printed circuit board surrounding the device.
This first-cut approach overestimates the heat sink size required, since heat flow through the board is not
accounted for, which can be as much as one-third to one-half of the power generated in the package.
Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling through the package and board and
the convection cooling due to the air moving through the application. Simplified thermal models of the
packages can be assembled using the junction-to-case and junction-to-board thermal resistances listed in
the thermal resistance table. More detailed thermal models can be made available on request.
The thermal performance of devices with heat sinks has been simulated with a few commercially available
heat sinks. The heat sink choice is determined by the application environment (temperature, air flow,
adjacent component power dissipation) and the physical space available. Because of the wide variety of
application environments, a single standard heat sink applicable to all cannot be specified.
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