• 參數(shù)資料
    型號: MPC8377VRANGA
    廠商: Freescale Semiconductor
    文件頁數(shù): 18/127頁
    文件大?。?/td> 0K
    描述: MPU POWERQUICC II 800MHZ 689PBGA
    標(biāo)準(zhǔn)包裝: 27
    系列: MPC83xx
    處理器類型: 32-位 MPC83xx PowerQUICC II Pro
    速度: 800MHz
    電壓: 1.05V
    安裝類型: 表面貼裝
    封裝/外殼: 689-BBGA 裸露焊盤
    供應(yīng)商設(shè)備封裝: 689-TEPBGA II(31x31)
    包裝: 托盤
    MPC8377E PowerQUICC II Pro Processor Hardware Specifications, Rev. 8
    114
    Freescale Semiconductor
    24 Thermal
    This section describes the thermal specifications of this chip.
    24.1
    Thermal Characteristics
    This table provides the package thermal characteristics for the 689 31
    × 31mm TePBGA II package.
    48.0
    0
    1
    2
    3
    576
    144
    288
    72 6
    36
    18
    360
    432
    66.7
    0
    1
    2
    533
    133
    266
    66.7
    33.3
    16.7
    333
    400
    25.0
    0
    4
    8
    800
    200
    100 6
    50
    25
    400
    500
    600
    33.3
    0
    2
    8
    533
    266.7
    267
    133 6
    66.7
    33.3
    400
    533
    667
    800
    50.0
    0
    4
    800
    200
    100 6
    50
    25
    400
    500
    600
    50.0
    0
    2
    8
    800
    400
    400 5
    100 6
    50
    600
    800
    66.7
    0
    2
    4
    533
    266.7
    267
    133 6
    66.7
    33.3
    400
    533
    667
    800
    66.7
    0
    2
    5
    667
    333
    83.3 6 41.6
    333
    500
    667
    66.7
    0
    2
    6
    800
    400
    400 5
    100 6
    50
    400
    600
    800
    Notes:
    1. Values in MHz.
    2. System PLL VCO range: 400–800 MHz.
    3. CSB frequencies less than 133 MHz will not support Gigabit Ethernet rates.
    4. Minimum data rate for DDR2 is 250 MHz and for DDR1 is 167 MHz.
    5. Applies to DDR2 only.
    6. Applies to eLBC PLL-enabled mode only.
    Table 81. Package Thermal Characteristics for TePBGA II
    Parameter
    Symbol
    Value
    Unit
    Note
    Junction-to-ambient natural convection on single layer board (1s)
    RθJA
    21
    °C/W
    1, 2
    Junction-to-ambient natural convection on four layer board (2s2p)
    RθJA
    15
    °C/W
    Junction-to-ambient (at 200 ft/min) on single layer board (1s)
    RθJMA
    16
    °C/W
    1, 3
    Junction-to-ambient (at 200 ft/min) on four layer board (2s2p)
    RθJMA
    12
    °C/W
    1, 3
    Junction-to-board thermal
    RθJB
    8
    °C/W
    Junction-to-case thermal
    RθJC
    6
    °C/W
    Table 80. Example Clock Frequency Combinations (continued)
    eLBC 1
    e300 Core 1
    Ref
    1
    LBCM DDRCM SVCOD SPMF
    Sys
    VCO
    1,2 CSB
    1,3 DDR data
    rate
    1,4
    /2
    /4
    /8
    × 1 × 1.5 × 2 × 2.5 × 3
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